CIRCUIT MODULE

PROBLEM TO BE SOLVED: To provide a circuit module which has an optimized shield structure for coping with an electromagnetic field or the like by improving a shield effect on the side surface of a conventional circuit module of a mass-production type. SOLUTION: In the circuit module, at the step of...

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1. Verfasser:	KAI TAKEHIKO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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creator	KAI TAKEHIKO
description	PROBLEM TO BE SOLVED: To provide a circuit module which has an optimized shield structure for coping with an electromagnetic field or the like by improving a shield effect on the side surface of a conventional circuit module of a mass-production type. SOLUTION: In the circuit module, at the step of forming a sealing resin part, a projecting strip 35 is provided in an upper tool 33 along an isolation line so that a trench 20 is formed in a sealing resin 13, and a shield layer 16 is formed in the trench and the sealing resin. Thereafter, at the step of isolating a collection substrate, a collection substrate 21 is cut by using a blade 26 narrower than a width of the trench 20, whereby the side of the shield layer 16 enclosing the sealing resin 13 is exposed to an isolated surface, and the shield structure having an excellent shield effect is formed in the side of the circuit module also. COPYRIGHT: (C)2004,JPO&NCIPI
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SOLUTION: In the circuit module, at the step of forming a sealing resin part, a projecting strip 35 is provided in an upper tool 33 along an isolation line so that a trench 20 is formed in a sealing resin 13, and a shield layer 16 is formed in the trench and the sealing resin. Thereafter, at the step of isolating a collection substrate, a collection substrate 21 is cut by using a blade 26 narrower than a width of the trench 20, whereby the side of the shield layer 16 enclosing the sealing resin 13 is exposed to an isolated surface, and the shield structure having an excellent shield effect is formed in the side of the circuit module also. 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SOLUTION: In the circuit module, at the step of forming a sealing resin part, a projecting strip 35 is provided in an upper tool 33 along an isolation line so that a trench 20 is formed in a sealing resin 13, and a shield layer 16 is formed in the trench and the sealing resin. Thereafter, at the step of isolating a collection substrate, a collection substrate 21 is cut by using a blade 26 narrower than a width of the trench 20, whereby the side of the shield layer 16 enclosing the sealing resin 13 is exposed to an isolated surface, and the shield structure having an excellent shield effect is formed in the side of the circuit module also. 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SOLUTION: In the circuit module, at the step of forming a sealing resin part, a projecting strip 35 is provided in an upper tool 33 along an isolation line so that a trench 20 is formed in a sealing resin 13, and a shield layer 16 is formed in the trench and the sealing resin. Thereafter, at the step of isolating a collection substrate, a collection substrate 21 is cut by using a blade 26 narrower than a width of the trench 20, whereby the side of the shield layer 16 enclosing the sealing resin 13 is exposed to an isolated surface, and the shield structure having an excellent shield effect is formed in the side of the circuit module also. COPYRIGHT: (C)2004,JPO&NCIPI</abstract><edition>7</edition><oa>free_for_read</oa></addata></record>
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subjects	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
title	CIRCUIT MODULE
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