SEMICONDUCTOR DEVICE
PROBLEM TO BE SOLVED: To provide a semiconductor device capable of being compatible with both the cases of connection to an external antenna and connection to an on-chip antenna. SOLUTION: The semiconductor device is provided with an antenna connection electrodes 1a, 2 provided at an outer edge of a...
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creator | NAKAYAMA OSAMU SHIRATO OSAMU WATANABE HIROTO OMICHI KAZUHIKO |
description | PROBLEM TO BE SOLVED: To provide a semiconductor device capable of being compatible with both the cases of connection to an external antenna and connection to an on-chip antenna. SOLUTION: The semiconductor device is provided with an antenna connection electrodes 1a, 2 provided at an outer edge of a semiconductor chip 10, an on-chip antenna connection electrode 1b provided inwardly from the antenna connection electrodes 1a, 2, and an internal circuit 4b formed to the semiconductor chip. The antenna connection electrodes 1a, 2 are connected to the internal circuit 4b by internal wires 4a, 4c. Further, the on-chip antenna connection electrode 1b is connected to the internal circuit 4b and the antenna connection electrode 2 by the internal wires 4a, 4c. An on-chip antenna 32 is connected to the antenna connection electrode 2 and the on-chip antenna connection electrode 1b. An external antenna 200 is connected to the antenna connection electrodes 1a, 2. COPYRIGHT: (C)2004,JPO&NCIPI |
format | Patent |
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SOLUTION: The semiconductor device is provided with an antenna connection electrodes 1a, 2 provided at an outer edge of a semiconductor chip 10, an on-chip antenna connection electrode 1b provided inwardly from the antenna connection electrodes 1a, 2, and an internal circuit 4b formed to the semiconductor chip. The antenna connection electrodes 1a, 2 are connected to the internal circuit 4b by internal wires 4a, 4c. Further, the on-chip antenna connection electrode 1b is connected to the internal circuit 4b and the antenna connection electrode 2 by the internal wires 4a, 4c. An on-chip antenna 32 is connected to the antenna connection electrode 2 and the on-chip antenna connection electrode 1b. An external antenna 200 is connected to the antenna connection electrodes 1a, 2. 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SOLUTION: The semiconductor device is provided with an antenna connection electrodes 1a, 2 provided at an outer edge of a semiconductor chip 10, an on-chip antenna connection electrode 1b provided inwardly from the antenna connection electrodes 1a, 2, and an internal circuit 4b formed to the semiconductor chip. The antenna connection electrodes 1a, 2 are connected to the internal circuit 4b by internal wires 4a, 4c. Further, the on-chip antenna connection electrode 1b is connected to the internal circuit 4b and the antenna connection electrode 2 by the internal wires 4a, 4c. An on-chip antenna 32 is connected to the antenna connection electrode 2 and the on-chip antenna connection electrode 1b. An external antenna 200 is connected to the antenna connection electrodes 1a, 2. COPYRIGHT: (C)2004,JPO&NCIPI</abstract><edition>7</edition><oa>free_for_read</oa></addata></record> |
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subjects | ANTENNAS, i.e. RADIO AERIALS BASIC ELECTRIC ELEMENTS CALCULATING COMPUTING COUNTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY HANDLING RECORD CARRIERS PHYSICS PRESENTATION OF DATA RECOGNITION OF DATA RECORD CARRIERS SEMICONDUCTOR DEVICES |
title | SEMICONDUCTOR DEVICE |
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