ELECTRONIC COMPONENT PACKAGING DEVICE

PROBLEM TO BE SOLVED: To more simplify the adjustment of an arrangement position of an electronic component feeder in an electronic component packaging device. SOLUTION: In the case of controlling the arrangement position of the electronic component feeder 3 arranged in a feeder bank 4 of the electr...

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1. Verfasser: KATAIGI TSUTOMU
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To more simplify the adjustment of an arrangement position of an electronic component feeder in an electronic component packaging device. SOLUTION: In the case of controlling the arrangement position of the electronic component feeder 3 arranged in a feeder bank 4 of the electronic component packaging device 100, a control means 10 with the feeder bank 4 is constituted so as to be externally operated by applying external force caused by the movement of a loaded head 5. A manipulated variable for externally operating the control means 10 by the loaded head 5 is calculated from a feature point of the electronic component feeder 3 photographed by an image pickup means, and a suitable position on which the electronic component feeder 3 is to be arranged to control the movement of the loaded heat 5. COPYRIGHT: (C)2004,JPO&NCIPI