CRUCIBLE FOR VAPOR DEPOSITION, VAPOR DEPOSITION SYSTEM, AND VAPOR DEPOSITION METHOD

PROBLEM TO BE SOLVED: To provide a vapor deposition method excellent in reproducibility by which a satisfactory organic thin film can efficiently be produced without depending on the form of a sublimable or meltable organic material. SOLUTION: In the crucible for vapor deposition where a vapor depos...

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1. Verfasser:	MATSUKAZE NORIYUKI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC HEATING ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SEMICONDUCTOR DEVICES SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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creator	MATSUKAZE NORIYUKI
description	PROBLEM TO BE SOLVED: To provide a vapor deposition method excellent in reproducibility by which a satisfactory organic thin film can efficiently be produced without depending on the form of a sublimable or meltable organic material. SOLUTION: In the crucible for vapor deposition where a vapor depositing material is heated and evaporated, a first shield board is provided at the part higher than the evaporation face of the vapor depositing material stored into the bottom part of the crucible, and a second shield board is provided at the part higher than the first shield board. COPYRIGHT: (C)2004,JPO&NCIPI
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SOLUTION: In the crucible for vapor deposition where a vapor depositing material is heated and evaporated, a first shield board is provided at the part higher than the evaporation face of the vapor depositing material stored into the bottom part of the crucible, and a second shield board is provided at the part higher than the first shield board. 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SOLUTION: In the crucible for vapor deposition where a vapor depositing material is heated and evaporated, a first shield board is provided at the part higher than the evaporation face of the vapor depositing material stored into the bottom part of the crucible, and a second shield board is provided at the part higher than the first shield board. 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SOLUTION: In the crucible for vapor deposition where a vapor depositing material is heated and evaporated, a first shield board is provided at the part higher than the evaporation face of the vapor depositing material stored into the bottom part of the crucible, and a second shield board is provided at the part higher than the first shield board. COPYRIGHT: (C)2004,JPO&NCIPI</abstract><edition>7</edition><oa>free_for_read</oa></addata></record>
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subjects	BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC HEATING ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SEMICONDUCTOR DEVICES SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
title	CRUCIBLE FOR VAPOR DEPOSITION, VAPOR DEPOSITION SYSTEM, AND VAPOR DEPOSITION METHOD
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