ELECTRONIC-COMPONENT MOUNTING APPARATUS
PROBLEM TO BE SOLVED: To mount on a board highly accurately and at a high speed such an electronic component as a bare IC chip which is fed so as to have its connection surface upside. SOLUTION: In an electronic-component mounting apparatus 1 which has an upside-down-component carrying means 25 for...
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| creator | HATA KANJI NARITA MASACHIKA |
| description | PROBLEM TO BE SOLVED: To mount on a board highly accurately and at a high speed such an electronic component as a bare IC chip which is fed so as to have its connection surface upside. SOLUTION: In an electronic-component mounting apparatus 1 which has an upside-down-component carrying means 25 for feeding electronic components 2 from a component feeding portion 5 to a component feeding position B, a mounting head 15 moving between the component feeding position B and a component mounting position A in the X-direction, and a board positioning means 7 for positioning a board 3, the upside-down-component carrying means 25 comprises a transferring means 26 for so taking out the respective electronic components 2 from the component feeding portion 5 as to transfer them, a first shuttle 27 for so holding thereon the plurality of transferred electronic components 2 in a line in the X-direction as to be able to move to a delivery position in the X-direction, and a second shuttle 28 which so holds collectively the plurality of electronic components 2 delivered from the first shuttle 27 as to turn them collectively upside down and so moves in the X-direction as to allocate them to the component feeding position B. COPYRIGHT: (C)2004,JPO |
| format | Patent |
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SOLUTION: In an electronic-component mounting apparatus 1 which has an upside-down-component carrying means 25 for feeding electronic components 2 from a component feeding portion 5 to a component feeding position B, a mounting head 15 moving between the component feeding position B and a component mounting position A in the X-direction, and a board positioning means 7 for positioning a board 3, the upside-down-component carrying means 25 comprises a transferring means 26 for so taking out the respective electronic components 2 from the component feeding portion 5 as to transfer them, a first shuttle 27 for so holding thereon the plurality of transferred electronic components 2 in a line in the X-direction as to be able to move to a delivery position in the X-direction, and a second shuttle 28 which so holds collectively the plurality of electronic components 2 delivered from the first shuttle 27 as to turn them collectively upside down and so moves in the X-direction as to allocate them to the component feeding position B. 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SOLUTION: In an electronic-component mounting apparatus 1 which has an upside-down-component carrying means 25 for feeding electronic components 2 from a component feeding portion 5 to a component feeding position B, a mounting head 15 moving between the component feeding position B and a component mounting position A in the X-direction, and a board positioning means 7 for positioning a board 3, the upside-down-component carrying means 25 comprises a transferring means 26 for so taking out the respective electronic components 2 from the component feeding portion 5 as to transfer them, a first shuttle 27 for so holding thereon the plurality of transferred electronic components 2 in a line in the X-direction as to be able to move to a delivery position in the X-direction, and a second shuttle 28 which so holds collectively the plurality of electronic components 2 delivered from the first shuttle 27 as to turn them collectively upside down and so moves in the X-direction as to allocate them to the component feeding position B. COPYRIGHT: (C)2004,JPO</abstract><edition>7</edition><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES |
| title | ELECTRONIC-COMPONENT MOUNTING APPARATUS |
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