FLEXIBLE PRINTED CIRCUIT BOARD

PROBLEM TO BE SOLVED: To provide an adhesive film with excellent thermal-stress reducing effect of siloxane unit and polyoxypropylene unit of modified polyamideimide resin, and a heat-resistant resin composition useful for a flexible printed circuit board, and to provide an adhesive film having fire-resistant effect of siloxane unit and aromatic unit of modified polyamideimide resin, an excellent flame resistance being free of halogen due to phosphorous compound which is a flame retardant aid, an excellent adhesion due to a stress mitigation action caused by micro phase separation structure of modified polyamideimide resin, and a heat-resistant resin composition useful for the flexible printed circuit board. SOLUTION: The flexible printed circuit board is obtained by bonding a copper foil to an adhesive film of a heat-resistant resin composition that contains (A) 100 pts.wt. of modified polyamideimide resin having micro phase separation structure, (B) 10-100 pts.wt. of thermosetting resin, and (C) 2-20 pts.wt. organic phosphorus compound. COPYRIGHT: (C)2004,JPO