SIDE-BONDING METHOD FOR FLIP CHIP SYSTEM IN SEMICONDUCTOR DEVICE, MEMS DEVICE PACKAGE AND PACKAGE METHOD USING THE SAME

PROBLEM TO BE SOLVED: To provide a bonding method of flip chip system in a semiconductor device, which is not influenced by the surface state of a substrate. SOLUTION: This bonding method includes a step (a) to form a first UBM along the bonding line on a lower substrate in which a semiconductor element is provided, a step (b) to apply solder plating onto the first UBM, a step (c) to form a trench at a position corresponding to solder plating in the bonding face of an upper substrate to be bonded on the lower substrate and form a second UBM on the trench, a step (d) to joint the upper and lower substrates by inserting solder into the trench, and a step (e) to joint the upper and lower substrates while melting solder toward the side of the trench by heating the jointed upper and lower substrates to a temperature higher than the melting temperature. COPYRIGHT: (C)2004,JPO