CERAMIC WIRING BOARD, WIRING BOARD WITH COMPONENTS MOUNTED THEREON, AND THEIR PRODUCING PROCESS

PROBLEM TO BE SOLVED: To provide a ceramic wiring board in which a solder bridging can be prevented effectively. SOLUTION: A board side terminal pad 155 is buried in a surface dielectric layer 250 such that the major surface P1 of the pad is recessed from the major surface of the surface dielectric...

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Bibliographische Detailangaben

1. Verfasser:	ORIGUCHI MAKOTO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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