CERAMIC WIRING BOARD, WIRING BOARD WITH COMPONENTS MOUNTED THEREON, AND THEIR PRODUCING PROCESS
PROBLEM TO BE SOLVED: To provide a ceramic wiring board in which a solder bridging can be prevented effectively. SOLUTION: A board side terminal pad 155 is buried in a surface dielectric layer 250 such that the major surface P1 of the pad is recessed from the major surface of the surface dielectric...
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| creator | ORIGUCHI MAKOTO |
| description | PROBLEM TO BE SOLVED: To provide a ceramic wiring board in which a solder bridging can be prevented effectively. SOLUTION: A board side terminal pad 155 is buried in a surface dielectric layer 250 such that the major surface P1 of the pad is recessed from the major surface of the surface dielectric layer 250. A recess 251 for exposing the major surface of the board side terminal pad 155 is opened in the major surface of the surface dielectric layer 250 at a position corresponding to the board side terminal pad 155 and filled with a solder joint 102 conducting with the board side terminal pad 155. The board side terminal pad 155 is entirely covered with metal plating layers 155n and 155a which are covered with the surface dielectric layer 250 except the part exposed in the recesses of the metal plating layers 155n and 155a. COPYRIGHT: (C)2004,JPO |
| format | Patent |
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SOLUTION: A board side terminal pad 155 is buried in a surface dielectric layer 250 such that the major surface P1 of the pad is recessed from the major surface of the surface dielectric layer 250. A recess 251 for exposing the major surface of the board side terminal pad 155 is opened in the major surface of the surface dielectric layer 250 at a position corresponding to the board side terminal pad 155 and filled with a solder joint 102 conducting with the board side terminal pad 155. The board side terminal pad 155 is entirely covered with metal plating layers 155n and 155a which are covered with the surface dielectric layer 250 except the part exposed in the recesses of the metal plating layers 155n and 155a. 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| subjects | BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES |
| title | CERAMIC WIRING BOARD, WIRING BOARD WITH COMPONENTS MOUNTED THEREON, AND THEIR PRODUCING PROCESS |
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