SUBSTRATE PROCESSING SYSTEM AND PROCESSING METHOD

PROBLEM TO BE SOLVED: To provide a substrate processing technology in which organic materials are removed efficiently. SOLUTION: A step for supplying a rotating substrate W with removing liquid (step S1), and a step for cutting the removing liquid by stopping supply of the removing liquid and turnin...

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Bibliographische Detailangaben
Hauptverfasser:	HASHIZUME AKIO, SUGIMOTO HIROAKI, TSUJIKAWA HIROTAKA
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CLEANING CLEANING IN GENERAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY PERFORMING OPERATIONS PREVENTION OF FOULING IN GENERAL SEMICONDUCTOR DEVICES TRANSPORTING
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a substrate processing technology in which organic materials are removed efficiently. SOLUTION: A step for supplying a rotating substrate W with removing liquid (step S1), and a step for cutting the removing liquid by stopping supply of the removing liquid and turning the substrate W (step S2) are repeated a specified number of times. Since new removing liquid is supplied again onto the surface of the substrate W after old removing liquid is cut, surface of the substrate W touches new removing liquid constantly, and thereby reaction products adhering to the substrate W are removed efficiently. COPYRIGHT: (C)2004,JPO