MANUFACTURING METHOD OF ELECTRONIC COMPONENT MOUNTING BODY

PROBLEM TO BE SOLVED: To prevent air bubbles remaining locally in an reinforcing resin. SOLUTION: A substrate 20 has a plurality of substrate electrodes 24 and 24 corresponding to solder bumps arrayed in lattice on a CSP, on a surface 22 on the side for mounting the CSP. When the CSP is mounted at a...

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Bibliographische Detailangaben

Hauptverfasser:	OBARA FUMIO, OGISO HOMARE
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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