MANUFACTURING METHOD OF ELECTRONIC COMPONENT MOUNTING BODY
PROBLEM TO BE SOLVED: To prevent air bubbles remaining locally in an reinforcing resin. SOLUTION: A substrate 20 has a plurality of substrate electrodes 24 and 24 corresponding to solder bumps arrayed in lattice on a CSP, on a surface 22 on the side for mounting the CSP. When the CSP is mounted at a...
Gespeichert in:
| Hauptverfasser: | , |
|---|---|
| Format: | Patent |
| Sprache: | eng |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | |
| container_start_page | |
| container_title | |
| container_volume | |
| creator | OBARA FUMIO OGISO HOMARE |
| description | PROBLEM TO BE SOLVED: To prevent air bubbles remaining locally in an reinforcing resin. SOLUTION: A substrate 20 has a plurality of substrate electrodes 24 and 24 corresponding to solder bumps arrayed in lattice on a CSP, on a surface 22 on the side for mounting the CSP. When the CSP is mounted at a position corresponding to the center of a square constituted of adjoining four substrate electrodes 24 and 24, a plurality of resin bonds 40 and 40 for reinforcement are applied thicker than the gap formed between the CSP and the substrate 20. When, under this condition, the CSP is mounted on the substrate so that the position of the solder bump disposed at the CSP agrees with that of the substrate electrodes 24 and 24, an escape route for air is assured between the solder bump and the resin bond 40 although the resin bonds 40 and 40 are spread by the CSP. So, the air within the space between the substrate 20 and the CSP escapes outside instead of confined by the resin bond 40. COPYRIGHT: (C)2004,JPO |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_JP2004095842A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>JP2004095842A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_JP2004095842A3</originalsourceid><addsrcrecordid>eNrjZLDydfQLdXN0DgkN8vRzV_B1DfHwd1Hwd1Nw9XF1Dgny9_N0VnD29w3w93P1C1Hw9Q_1CwGpc_J3ieRhYE1LzClO5YXS3AxKbq4hzh66qQX58anFBYnJqXmpJfFeAUYGBiYGlqYWJkaOxkQpAgAlOym9</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>MANUFACTURING METHOD OF ELECTRONIC COMPONENT MOUNTING BODY</title><source>esp@cenet</source><creator>OBARA FUMIO ; OGISO HOMARE</creator><creatorcontrib>OBARA FUMIO ; OGISO HOMARE</creatorcontrib><description>PROBLEM TO BE SOLVED: To prevent air bubbles remaining locally in an reinforcing resin. SOLUTION: A substrate 20 has a plurality of substrate electrodes 24 and 24 corresponding to solder bumps arrayed in lattice on a CSP, on a surface 22 on the side for mounting the CSP. When the CSP is mounted at a position corresponding to the center of a square constituted of adjoining four substrate electrodes 24 and 24, a plurality of resin bonds 40 and 40 for reinforcement are applied thicker than the gap formed between the CSP and the substrate 20. When, under this condition, the CSP is mounted on the substrate so that the position of the solder bump disposed at the CSP agrees with that of the substrate electrodes 24 and 24, an escape route for air is assured between the solder bump and the resin bond 40 although the resin bonds 40 and 40 are spread by the CSP. So, the air within the space between the substrate 20 and the CSP escapes outside instead of confined by the resin bond 40. COPYRIGHT: (C)2004,JPO</description><edition>7</edition><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS ; SEMICONDUCTOR DEVICES</subject><creationdate>2004</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20040325&DB=EPODOC&CC=JP&NR=2004095842A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,778,883,25551,76302</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20040325&DB=EPODOC&CC=JP&NR=2004095842A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>OBARA FUMIO</creatorcontrib><creatorcontrib>OGISO HOMARE</creatorcontrib><title>MANUFACTURING METHOD OF ELECTRONIC COMPONENT MOUNTING BODY</title><description>PROBLEM TO BE SOLVED: To prevent air bubbles remaining locally in an reinforcing resin. SOLUTION: A substrate 20 has a plurality of substrate electrodes 24 and 24 corresponding to solder bumps arrayed in lattice on a CSP, on a surface 22 on the side for mounting the CSP. When the CSP is mounted at a position corresponding to the center of a square constituted of adjoining four substrate electrodes 24 and 24, a plurality of resin bonds 40 and 40 for reinforcement are applied thicker than the gap formed between the CSP and the substrate 20. When, under this condition, the CSP is mounted on the substrate so that the position of the solder bump disposed at the CSP agrees with that of the substrate electrodes 24 and 24, an escape route for air is assured between the solder bump and the resin bond 40 although the resin bonds 40 and 40 are spread by the CSP. So, the air within the space between the substrate 20 and the CSP escapes outside instead of confined by the resin bond 40. COPYRIGHT: (C)2004,JPO</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2004</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZLDydfQLdXN0DgkN8vRzV_B1DfHwd1Hwd1Nw9XF1Dgny9_N0VnD29w3w93P1C1Hw9Q_1CwGpc_J3ieRhYE1LzClO5YXS3AxKbq4hzh66qQX58anFBYnJqXmpJfFeAUYGBiYGlqYWJkaOxkQpAgAlOym9</recordid><startdate>20040325</startdate><enddate>20040325</enddate><creator>OBARA FUMIO</creator><creator>OGISO HOMARE</creator><scope>EVB</scope></search><sort><creationdate>20040325</creationdate><title>MANUFACTURING METHOD OF ELECTRONIC COMPONENT MOUNTING BODY</title><author>OBARA FUMIO ; OGISO HOMARE</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2004095842A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2004</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>OBARA FUMIO</creatorcontrib><creatorcontrib>OGISO HOMARE</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>OBARA FUMIO</au><au>OGISO HOMARE</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>MANUFACTURING METHOD OF ELECTRONIC COMPONENT MOUNTING BODY</title><date>2004-03-25</date><risdate>2004</risdate><abstract>PROBLEM TO BE SOLVED: To prevent air bubbles remaining locally in an reinforcing resin. SOLUTION: A substrate 20 has a plurality of substrate electrodes 24 and 24 corresponding to solder bumps arrayed in lattice on a CSP, on a surface 22 on the side for mounting the CSP. When the CSP is mounted at a position corresponding to the center of a square constituted of adjoining four substrate electrodes 24 and 24, a plurality of resin bonds 40 and 40 for reinforcement are applied thicker than the gap formed between the CSP and the substrate 20. When, under this condition, the CSP is mounted on the substrate so that the position of the solder bump disposed at the CSP agrees with that of the substrate electrodes 24 and 24, an escape route for air is assured between the solder bump and the resin bond 40 although the resin bonds 40 and 40 are spread by the CSP. So, the air within the space between the substrate 20 and the CSP escapes outside instead of confined by the resin bond 40. COPYRIGHT: (C)2004,JPO</abstract><edition>7</edition><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | |
| ispartof | |
| issn | |
| language | eng |
| recordid | cdi_epo_espacenet_JP2004095842A |
| source | esp@cenet |
| subjects | BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES |
| title | MANUFACTURING METHOD OF ELECTRONIC COMPONENT MOUNTING BODY |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-16T01%3A04%3A18IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=OBARA%20FUMIO&rft.date=2004-03-25&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EJP2004095842A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |