MULTILAYER METAL FOIL CLAD LAMINATE AND ITS MANUFACTURING METHOD, AND MULTILAYER PRINTED CIRCUIT BOARD
PROBLEM TO BE SOLVED: To provide a multilayer metal foil clad laminate which has no resin residues on the front surface of the outermost layer of the metal foil and hardly has damages, hit marks, or pin holes, and has a high interlayer alignment accuracy. SOLUTION: The multilayer metal foil clad lam...
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| creator | MORIOKA KAZUNOBU |
| description | PROBLEM TO BE SOLVED: To provide a multilayer metal foil clad laminate which has no resin residues on the front surface of the outermost layer of the metal foil and hardly has damages, hit marks, or pin holes, and has a high interlayer alignment accuracy. SOLUTION: The multilayer metal foil clad laminate comprises a substrate 6 for an outer layer which is such that a circuit pattern 1 is formed on one face and, on the other face, a circuit formation region 3 for the metal foil 2 which is not yet formed into a circuit and a non-circuit pattern 4 are formed, with the circuit formation region 3 covered with a protection sheet 5; and a substrate 8 for an inner layer which is formed with a circuit pattern 7 at least on one face. The substrate 6 for an outer layer and the substrate 8 for an inner layer are stacked by bonding the circuit pattern 1-formed face of the substrate 6 for an outer layer and the circuit pattern 7-formed face of the substrate 8 for an inner layer by means of a prepreg 9. COPYRIGHT: (C)2004,JPO |
| format | Patent |
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SOLUTION: The multilayer metal foil clad laminate comprises a substrate 6 for an outer layer which is such that a circuit pattern 1 is formed on one face and, on the other face, a circuit formation region 3 for the metal foil 2 which is not yet formed into a circuit and a non-circuit pattern 4 are formed, with the circuit formation region 3 covered with a protection sheet 5; and a substrate 8 for an inner layer which is formed with a circuit pattern 7 at least on one face. The substrate 6 for an outer layer and the substrate 8 for an inner layer are stacked by bonding the circuit pattern 1-formed face of the substrate 6 for an outer layer and the circuit pattern 7-formed face of the substrate 8 for an inner layer by means of a prepreg 9. 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SOLUTION: The multilayer metal foil clad laminate comprises a substrate 6 for an outer layer which is such that a circuit pattern 1 is formed on one face and, on the other face, a circuit formation region 3 for the metal foil 2 which is not yet formed into a circuit and a non-circuit pattern 4 are formed, with the circuit formation region 3 covered with a protection sheet 5; and a substrate 8 for an inner layer which is formed with a circuit pattern 7 at least on one face. The substrate 6 for an outer layer and the substrate 8 for an inner layer are stacked by bonding the circuit pattern 1-formed face of the substrate 6 for an outer layer and the circuit pattern 7-formed face of the substrate 8 for an inner layer by means of a prepreg 9. COPYRIGHT: (C)2004,JPO</abstract><edition>7</edition><oa>free_for_read</oa></addata></record> |
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| subjects | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PERFORMING OPERATIONS PRINTED CIRCUITS TRANSPORTING |
| title | MULTILAYER METAL FOIL CLAD LAMINATE AND ITS MANUFACTURING METHOD, AND MULTILAYER PRINTED CIRCUIT BOARD |
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