MULTILAYER CIRCUIT BOARD, METHOD OF PROCESSING BLIND HOLE THEREIN AND PROBE FOR MEASUREMENT

PROBLEM TO BE SOLVED: To provide a method of processing a blind hole in a multilayer circuit board which allows easy confirmation of the location of an inner layer and can increase the processing accuracy, and also to provide the multilayer circuit board and a probe for inspection. SOLUTION: Conduct...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	ITO YASUSHI, YUKI TORU, OTANI TAMIO
Format:	Patent
Sprache:	eng
Schlagworte:	BORING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOTDIRECTED TO A PARTICULAR RESULT DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g.ARRANGEMENTS FOR COPYING OR CONTROLLING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OFPARTICULAR DETAILS OR COMPONENTS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS PRINTED CIRCUITS TRANSPORTING TURNING
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