METHOD OF MOUNTING ELECTRONIC COMPONENT, BONDING SHEET FOR ELECTRONIC COMPONENT, AND ELECTRONIC COMPONENT
PROBLEM TO BE SOLVED: To provide a method by which an electronic component can be mounted on a wiring board with high electrical connection reliability without causing any undesirable electrical short circuit. SOLUTION: A bonding sheet for mounting on which conductive bonding films 5 and insulating...
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| creator | FUKUDA KENICHI NAKAGAWA SEISHI |
| description | PROBLEM TO BE SOLVED: To provide a method by which an electronic component can be mounted on a wiring board with high electrical connection reliability without causing any undesirable electrical short circuit. SOLUTION: A bonding sheet for mounting on which conductive bonding films 5 and insulating bonding films 6 are formed is prepared on a carrier film, and the bonding films 5 and 6 are transferred to the surface of the electronic component 2 or wiring board 7 from the bonding sheet. Then the component 2 is mounted on the board 7 in a state where the bonding films 5 and 6 are arranged between the component 2 and the board 7, and the component 2 is mechanically joined to the board 7 with an electrical insulating resin constituting the insulating bonding films 6 in a state where the conductive bonding films 5 are separated from each other. At the same time, connection terminals 3 are electrically connected to conductive lands 8 through the conductive bonding films 5. COPYRIGHT: (C)2004,JPO |
| format | Patent |
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SOLUTION: A bonding sheet for mounting on which conductive bonding films 5 and insulating bonding films 6 are formed is prepared on a carrier film, and the bonding films 5 and 6 are transferred to the surface of the electronic component 2 or wiring board 7 from the bonding sheet. Then the component 2 is mounted on the board 7 in a state where the bonding films 5 and 6 are arranged between the component 2 and the board 7, and the component 2 is mechanically joined to the board 7 with an electrical insulating resin constituting the insulating bonding films 6 in a state where the conductive bonding films 5 are separated from each other. At the same time, connection terminals 3 are electrically connected to conductive lands 8 through the conductive bonding films 5. 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SOLUTION: A bonding sheet for mounting on which conductive bonding films 5 and insulating bonding films 6 are formed is prepared on a carrier film, and the bonding films 5 and 6 are transferred to the surface of the electronic component 2 or wiring board 7 from the bonding sheet. Then the component 2 is mounted on the board 7 in a state where the bonding films 5 and 6 are arranged between the component 2 and the board 7, and the component 2 is mechanically joined to the board 7 with an electrical insulating resin constituting the insulating bonding films 6 in a state where the conductive bonding films 5 are separated from each other. At the same time, connection terminals 3 are electrically connected to conductive lands 8 through the conductive bonding films 5. 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SOLUTION: A bonding sheet for mounting on which conductive bonding films 5 and insulating bonding films 6 are formed is prepared on a carrier film, and the bonding films 5 and 6 are transferred to the surface of the electronic component 2 or wiring board 7 from the bonding sheet. Then the component 2 is mounted on the board 7 in a state where the bonding films 5 and 6 are arranged between the component 2 and the board 7, and the component 2 is mechanically joined to the board 7 with an electrical insulating resin constituting the insulating bonding films 6 in a state where the conductive bonding films 5 are separated from each other. At the same time, connection terminals 3 are electrically connected to conductive lands 8 through the conductive bonding films 5. COPYRIGHT: (C)2004,JPO</abstract><edition>7</edition><oa>free_for_read</oa></addata></record> |
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| language | eng |
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| subjects | BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION ORPROCESSING OF GOODS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINSTCLIMATE CHANGE |
| title | METHOD OF MOUNTING ELECTRONIC COMPONENT, BONDING SHEET FOR ELECTRONIC COMPONENT, AND ELECTRONIC COMPONENT |
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