DUAL INTERFACE CARD AND ITS MANUFACTURING METHOD
PROBLEM TO BE SOLVED: To provide a dual interface card in which the adhesive strength and electrical bonding reliability of a tab substrate to a card surface are improved and bending, deformation, or the like caused by heat of the card surface can be suppressed, and to provide a method of manufactur...
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| creator | KUDO KIKUKO TAKAHASHI ISAO ISHII OSAMU |
| description | PROBLEM TO BE SOLVED: To provide a dual interface card in which the adhesive strength and electrical bonding reliability of a tab substrate to a card surface are improved and bending, deformation, or the like caused by heat of the card surface can be suppressed, and to provide a method of manufacturing the dual interface card. SOLUTION: An IC chip 41 is mounted on an antenna substrate 31 with antenna wiring formed thereon to be incorporated in a card main body 34, and the tab substrate 35 is adhered onto the card main body 34 by using the entire rear surface of the tab substrate 35. Electrical connection between the tab substrate 35 and a wiring pattern 37a is performed by bumps 36, and when the tub substrate 35 is connected with the wiring pattern 37a, the bonding reliability is increased by applying ultrasonic vibrations. As an adhesive material layer 45, a two-liquid adhesive is used to increase the adhesive strength. COPYRIGHT: (C)2004,JPO |
| format | Patent |
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SOLUTION: An IC chip 41 is mounted on an antenna substrate 31 with antenna wiring formed thereon to be incorporated in a card main body 34, and the tab substrate 35 is adhered onto the card main body 34 by using the entire rear surface of the tab substrate 35. Electrical connection between the tab substrate 35 and a wiring pattern 37a is performed by bumps 36, and when the tub substrate 35 is connected with the wiring pattern 37a, the bonding reliability is increased by applying ultrasonic vibrations. As an adhesive material layer 45, a two-liquid adhesive is used to increase the adhesive strength. 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SOLUTION: An IC chip 41 is mounted on an antenna substrate 31 with antenna wiring formed thereon to be incorporated in a card main body 34, and the tab substrate 35 is adhered onto the card main body 34 by using the entire rear surface of the tab substrate 35. Electrical connection between the tab substrate 35 and a wiring pattern 37a is performed by bumps 36, and when the tub substrate 35 is connected with the wiring pattern 37a, the bonding reliability is increased by applying ultrasonic vibrations. As an adhesive material layer 45, a two-liquid adhesive is used to increase the adhesive strength. 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SOLUTION: An IC chip 41 is mounted on an antenna substrate 31 with antenna wiring formed thereon to be incorporated in a card main body 34, and the tab substrate 35 is adhered onto the card main body 34 by using the entire rear surface of the tab substrate 35. Electrical connection between the tab substrate 35 and a wiring pattern 37a is performed by bumps 36, and when the tub substrate 35 is connected with the wiring pattern 37a, the bonding reliability is increased by applying ultrasonic vibrations. As an adhesive material layer 45, a two-liquid adhesive is used to increase the adhesive strength. COPYRIGHT: (C)2004,JPO</abstract><edition>7</edition><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS CALCULATING COMPUTING COUNTING CURRENT COLLECTORS ELECTRICITY HANDLING RECORD CARRIERS LINE CONNECTORS PHYSICS PRESENTATION OF DATA RECOGNITION OF DATA RECORD CARRIERS |
| title | DUAL INTERFACE CARD AND ITS MANUFACTURING METHOD |
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