MOUNTING DEVICE AND METHOD

PROBLEM TO BE SOLVED: To provide a mounting device and method which enables at least one of the improvements of a yield, the reduction of the cost of the device, and the accuracy of alignment. SOLUTION: The mounting device for mounting an object on the predetermined position of a substrate is provid...

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Bibliographische Detailangaben
1. Verfasser:	HAYASHI HIROOKI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS OPTICS PHYSICS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a mounting device and method which enables at least one of the improvements of a yield, the reduction of the cost of the device, and the accuracy of alignment. SOLUTION: The mounting device for mounting an object on the predetermined position of a substrate is provided with a first supporting unit comprising a first supporting surface for supporting one surface of the object and a second supporting unit comprising a second supporting surface for supporting the different surface of the object. COPYRIGHT: (C)2004,JPO