JET NOZZLE STRUCTURE OF LOCAL SOLDERING DEVICE
PROBLEM TO BE SOLVED: To provide a jet nozzle structure of a local soldering device by solving a problem that an overflow from the jet nozzle is brought into contact with a lead wire of electronic components in soldering using the jet nozzle to a local part of a substrate with components disposed wi...
Gespeichert in:
Hauptverfasser: | , |
---|---|
Format: | Patent |
Sprache: | eng |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Zusammenfassung: | PROBLEM TO BE SOLVED: To provide a jet nozzle structure of a local soldering device by solving a problem that an overflow from the jet nozzle is brought into contact with a lead wire of electronic components in soldering using the jet nozzle to a local part of a substrate with components disposed with high density. SOLUTION: A jet nozzle 1 has an opening edge part 2e of a predetermined shape on an upper part thereof, and a cylindrical body 2 communicated with a solder tank (b) storing molten solder (h), is formed at a lower part thereof. The molten solder (h) is waved upwardly to the opening edge part 2e in the cylindrical body 2 by a circulating means (not shown). One or two or more discharge ports 2h are formed in a side wall 2s of the cylindrical body 2 separately downward of the opening edge part 2e by an adequate distance. COPYRIGHT: (C)2004,JPO |
---|