HIGH-FREQUENCY FEEDER ROD
PROBLEM TO BE SOLVED: To solve the problem of the overheating of a high-frequency feeder rod 1 caused by inadequate cooling by air due to poor cooling efficiency in a conventional high-frequency feeder rod 1, since the temperature rise of the feeder rod 1 is excessively large due to increased high-f...
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| creator | NONAKA TATSU |
| description | PROBLEM TO BE SOLVED: To solve the problem of the overheating of a high-frequency feeder rod 1 caused by inadequate cooling by air due to poor cooling efficiency in a conventional high-frequency feeder rod 1, since the temperature rise of the feeder rod 1 is excessively large due to increased high-frequency resistance as high-frequency power increases with an increase in size of the object to be treated such as a wafer. SOLUTION: This high-frequency feeder rod 20 is used to feed high-frequency power to a lower electrode 12 for plasma treatment to a wafer W, and is composed of an electrically conductive rod having a passage 20A for a coolant (for example, air) in its inside, while a plurality of fin-shaped protrusions 20B that protrude inside the passage 20A are arranged as a means for expanding heat absorption area by the air. COPYRIGHT: (C)2004,JPO |
| format | Patent |
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SOLUTION: This high-frequency feeder rod 20 is used to feed high-frequency power to a lower electrode 12 for plasma treatment to a wafer W, and is composed of an electrically conductive rod having a passage 20A for a coolant (for example, air) in its inside, while a plurality of fin-shaped protrusions 20B that protrude inside the passage 20A are arranged as a means for expanding heat absorption area by the air. 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SOLUTION: This high-frequency feeder rod 20 is used to feed high-frequency power to a lower electrode 12 for plasma treatment to a wafer W, and is composed of an electrically conductive rod having a passage 20A for a coolant (for example, air) in its inside, while a plurality of fin-shaped protrusions 20B that protrude inside the passage 20A are arranged as a means for expanding heat absorption area by the air. 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SOLUTION: This high-frequency feeder rod 20 is used to feed high-frequency power to a lower electrode 12 for plasma treatment to a wafer W, and is composed of an electrically conductive rod having a passage 20A for a coolant (for example, air) in its inside, while a plurality of fin-shaped protrusions 20B that protrude inside the passage 20A are arranged as a means for expanding heat absorption area by the air. COPYRIGHT: (C)2004,JPO</abstract><edition>7</edition><oa>free_for_read</oa></addata></record> |
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| language | eng |
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| subjects | BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SEMICONDUCTOR DEVICES SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION |
| title | HIGH-FREQUENCY FEEDER ROD |
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