ELECTRONIC APPARATUS CASING AND ITS MANUFACTURING METHOD
PROBLEM TO BE SOLVED: To manufacture a lightweight electronic apparatus casing with excellent cooling efficiency at a low cost. SOLUTION: The electronic apparatus casing comprises a radiation fin 2 formed of a material excellent in a radiation effect; and a lightweight Mg alloy-made casing 1 in whic...
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| creator | MAEJIMA SHIGETO KANEKO KIMIHIRO |
| description | PROBLEM TO BE SOLVED: To manufacture a lightweight electronic apparatus casing with excellent cooling efficiency at a low cost. SOLUTION: The electronic apparatus casing comprises a radiation fin 2 formed of a material excellent in a radiation effect; and a lightweight Mg alloy-made casing 1 in which the radiation fin previously arranged in a casing metal mold is integrally formed by injection molding, and the electronic apparatus casing is manufactured. A fitting detent 3 is provided in the region of a joining plane of a casing main body of the radiation fin 2, and when a Mg alloy is filled in the casing metal mold by thixo-molding, the fitting detent 3 is deformed under the filling pressure of the Mg alloy, to raise fitting strength between the radiation fin 2 and the Mg alloy-made casing 1. COPYRIGHT: (C)2003,JPO |
| format | Patent |
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SOLUTION: The electronic apparatus casing comprises a radiation fin 2 formed of a material excellent in a radiation effect; and a lightweight Mg alloy-made casing 1 in which the radiation fin previously arranged in a casing metal mold is integrally formed by injection molding, and the electronic apparatus casing is manufactured. A fitting detent 3 is provided in the region of a joining plane of a casing main body of the radiation fin 2, and when a Mg alloy is filled in the casing metal mold by thixo-molding, the fitting detent 3 is deformed under the filling pressure of the Mg alloy, to raise fitting strength between the radiation fin 2 and the Mg alloy-made casing 1. 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SOLUTION: The electronic apparatus casing comprises a radiation fin 2 formed of a material excellent in a radiation effect; and a lightweight Mg alloy-made casing 1 in which the radiation fin previously arranged in a casing metal mold is integrally formed by injection molding, and the electronic apparatus casing is manufactured. A fitting detent 3 is provided in the region of a joining plane of a casing main body of the radiation fin 2, and when a Mg alloy is filled in the casing metal mold by thixo-molding, the fitting detent 3 is deformed under the filling pressure of the Mg alloy, to raise fitting strength between the radiation fin 2 and the Mg alloy-made casing 1. 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SOLUTION: The electronic apparatus casing comprises a radiation fin 2 formed of a material excellent in a radiation effect; and a lightweight Mg alloy-made casing 1 in which the radiation fin previously arranged in a casing metal mold is integrally formed by injection molding, and the electronic apparatus casing is manufactured. A fitting detent 3 is provided in the region of a joining plane of a casing main body of the radiation fin 2, and when a Mg alloy is filled in the casing metal mold by thixo-molding, the fitting detent 3 is deformed under the filling pressure of the Mg alloy, to raise fitting strength between the radiation fin 2 and the Mg alloy-made casing 1. COPYRIGHT: (C)2003,JPO</abstract><edition>7</edition><oa>free_for_read</oa></addata></record> |
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| subjects | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CASTING CASTING OF METALS CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PERFORMING OPERATIONS POWDER METALLURGY PRINTED CIRCUITS TRANSPORTING |
| title | ELECTRONIC APPARATUS CASING AND ITS MANUFACTURING METHOD |
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