HEAT-GENERATING-ELEMENT COOLING DEVICE HAVING FAN AND POWER-ELECTRONIC EQUIPMENT FURNISHED THEREWITH

PROBLEM TO BE SOLVED: To provide a heat-generating-element cooling device having a fan, whose cooling performance is enhanced, and power-electronic equipment furnished therewith. SOLUTION: This heat-generating-element cooling device 5 is furnished with a fan 4 arranged on the top end 1c, which faces...

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1. Verfasser:	NAKAHAMA YOSHIFUMI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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creator	NAKAHAMA YOSHIFUMI
description	PROBLEM TO BE SOLVED: To provide a heat-generating-element cooling device having a fan, whose cooling performance is enhanced, and power-electronic equipment furnished therewith. SOLUTION: This heat-generating-element cooling device 5 is furnished with a fan 4 arranged on the top end 1c, which faces a base 1a, of a fin of a heat sink 2, wherein the heat sink 2 has a fin group composed of a plurality of radially arranged fins 1. A heat-generating element 3 is mounted on the heat sink 2. The height of each fin 1 in the top end 1c is gradually lowered from the top end 4a of a fan blade to the central part 4b of the fan. Consequently, an air flow is also directed toward the central part of the fin group, and is prevented from escaping from the outer peripheral side 1b of the fin to the outer periphery. As a consequence, the cooling performance is enhanced, and the junction temperature rise of the heat-generating element 3 is reduced. COPYRIGHT: (C)2003,JPO
format	Patent
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SOLUTION: This heat-generating-element cooling device 5 is furnished with a fan 4 arranged on the top end 1c, which faces a base 1a, of a fin of a heat sink 2, wherein the heat sink 2 has a fin group composed of a plurality of radially arranged fins 1. A heat-generating element 3 is mounted on the heat sink 2. The height of each fin 1 in the top end 1c is gradually lowered from the top end 4a of a fan blade to the central part 4b of the fan. Consequently, an air flow is also directed toward the central part of the fin group, and is prevented from escaping from the outer peripheral side 1b of the fin to the outer periphery. As a consequence, the cooling performance is enhanced, and the junction temperature rise of the heat-generating element 3 is reduced. COPYRIGHT: (C)2003,JPO</abstract><edition>7</edition><oa>free_for_read</oa></addata></record>
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subjects	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
title	HEAT-GENERATING-ELEMENT COOLING DEVICE HAVING FAN AND POWER-ELECTRONIC EQUIPMENT FURNISHED THEREWITH
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