THERMOCOMPRESSION BONDING DEVICE

PROBLEM TO BE SOLVED: To provide a thermocompression bonding device which enhances manufacturing workability, reduces a manufacturing cost and eliminates strains in two substrates of the glass substrates stuck together for a liquid crystal panel. SOLUTION: An empty cell 10 is arranged between a meta...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser: MARUTA TAKASHI
Format: Patent
Sprache:eng
Schlagworte:
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