HEATING CONNECTION DEVICE, HEATING CONNECTION METHOD, AND STRUCTURE OF CONNECTION BETWEEN SOFT BOARD AND HARD BOARD
PROBLEM TO BE SOLVED: To provide a heating connection device and a heating connection method, which are capable of preventing a flexible board from separating from a hard board after they are connected to each other by improving bonding strength in joints when soldering and thermocompression bonding...
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| creator | MINAMINO MITSUHARU GOTO KIYOSHI |
| description | PROBLEM TO BE SOLVED: To provide a heating connection device and a heating connection method, which are capable of preventing a flexible board from separating from a hard board after they are connected to each other by improving bonding strength in joints when soldering and thermocompression bonding are carried out at the same time. SOLUTION: A heater chip 201 is equipped with a first heating unit 202 which heats a first joint formed by soldering a terminal unit 3 formed on the hard board 1 to a terminal unit formed on the flexible board 4 and a second heating unit 203 which heats a second joint adjacent to the first joint and formed by the use of a thermal adhesive tape 8 bonding the hard board 1 to the flexible board 4. A level difference 11 between pressing surface of the heating units 202 and 203 is so set as to make an adhesive agent layer formed on the thermal adhesive tape 8 thick enough to enable the adhesive agent layer to attain prescribed bonding strength when the second joint is pressed. COPYRIGHT: (C)2003,JPO |
| format | Patent |
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SOLUTION: A heater chip 201 is equipped with a first heating unit 202 which heats a first joint formed by soldering a terminal unit 3 formed on the hard board 1 to a terminal unit formed on the flexible board 4 and a second heating unit 203 which heats a second joint adjacent to the first joint and formed by the use of a thermal adhesive tape 8 bonding the hard board 1 to the flexible board 4. A level difference 11 between pressing surface of the heating units 202 and 203 is so set as to make an adhesive agent layer formed on the thermal adhesive tape 8 thick enough to enable the adhesive agent layer to attain prescribed bonding strength when the second joint is pressed. 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SOLUTION: A heater chip 201 is equipped with a first heating unit 202 which heats a first joint formed by soldering a terminal unit 3 formed on the hard board 1 to a terminal unit formed on the flexible board 4 and a second heating unit 203 which heats a second joint adjacent to the first joint and formed by the use of a thermal adhesive tape 8 bonding the hard board 1 to the flexible board 4. A level difference 11 between pressing surface of the heating units 202 and 203 is so set as to make an adhesive agent layer formed on the thermal adhesive tape 8 thick enough to enable the adhesive agent layer to attain prescribed bonding strength when the second joint is pressed. 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SOLUTION: A heater chip 201 is equipped with a first heating unit 202 which heats a first joint formed by soldering a terminal unit 3 formed on the hard board 1 to a terminal unit formed on the flexible board 4 and a second heating unit 203 which heats a second joint adjacent to the first joint and formed by the use of a thermal adhesive tape 8 bonding the hard board 1 to the flexible board 4. A level difference 11 between pressing surface of the heating units 202 and 203 is so set as to make an adhesive agent layer formed on the thermal adhesive tape 8 thick enough to enable the adhesive agent layer to attain prescribed bonding strength when the second joint is pressed. COPYRIGHT: (C)2003,JPO</abstract><edition>7</edition><oa>free_for_read</oa></addata></record> |
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| subjects | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING DEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH ISMODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THEDEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY,COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g.SWITCHING, GATING, MODULATING OR DEMODULATING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY FREQUENCY-CHANGING MACHINE TOOLS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR NON-LINEAR OPTICS OPTICAL ANALOGUE/DIGITAL CONVERTERS OPTICAL LOGIC ELEMENTS OPTICS PERFORMING OPERATIONS PHYSICS PRINTED CIRCUITS SOLDERING OR UNSOLDERING TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF TRANSPORTING WELDING WORKING BY LASER BEAM |
| title | HEATING CONNECTION DEVICE, HEATING CONNECTION METHOD, AND STRUCTURE OF CONNECTION BETWEEN SOFT BOARD AND HARD BOARD |
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