MANUFACTURING METHOD OF MULTILAYER PRINTED WIRING BOARD
PROBLEM TO BE SOLVED: To provide a manufacturing method of a multilayer printed wiring board which enables lamination without the interlayer misregistration of a circuit board. SOLUTION: A plurality of circuit boards 1 are laminated via a prepreg 2 by repeating binding operations for binding the cir...
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| creator | MORIOKA KAZUNOBU |
| description | PROBLEM TO BE SOLVED: To provide a manufacturing method of a multilayer printed wiring board which enables lamination without the interlayer misregistration of a circuit board. SOLUTION: A plurality of circuit boards 1 are laminated via a prepreg 2 by repeating binding operations for binding the circuit board 1 to both sides of the prepreg 2 a plurality of times by partially heat-welding the resin of the prepreg 2 to the circuit board 1 by laminating the circuit boards 1 via the prepreg 2 and by locally heating and pressurizing it in a plurality of places not less than three along an end edge. Thereafter, they are molded by heating and pressurization, and a multilayer printed wiring board is manufactured by laminating and integrating the plurality of circuit boards 1 via an insulation adhesion layer 3 by the prepreg 2. In the process, the circuit board 1 is bound to both sides of the prepreg 2 by locally heating and pressurizing the circuit board in a place shifted so that at least the places of both ends of a plurality of places not less than three along an end edge are not the same positions in a preceding binding operation and a following binding operation. COPYRIGHT: (C)2003,JPO |
| format | Patent |
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SOLUTION: A plurality of circuit boards 1 are laminated via a prepreg 2 by repeating binding operations for binding the circuit board 1 to both sides of the prepreg 2 a plurality of times by partially heat-welding the resin of the prepreg 2 to the circuit board 1 by laminating the circuit boards 1 via the prepreg 2 and by locally heating and pressurizing it in a plurality of places not less than three along an end edge. Thereafter, they are molded by heating and pressurization, and a multilayer printed wiring board is manufactured by laminating and integrating the plurality of circuit boards 1 via an insulation adhesion layer 3 by the prepreg 2. In the process, the circuit board 1 is bound to both sides of the prepreg 2 by locally heating and pressurizing the circuit board in a place shifted so that at least the places of both ends of a plurality of places not less than three along an end edge are not the same positions in a preceding binding operation and a following binding operation. 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SOLUTION: A plurality of circuit boards 1 are laminated via a prepreg 2 by repeating binding operations for binding the circuit board 1 to both sides of the prepreg 2 a plurality of times by partially heat-welding the resin of the prepreg 2 to the circuit board 1 by laminating the circuit boards 1 via the prepreg 2 and by locally heating and pressurizing it in a plurality of places not less than three along an end edge. Thereafter, they are molded by heating and pressurization, and a multilayer printed wiring board is manufactured by laminating and integrating the plurality of circuit boards 1 via an insulation adhesion layer 3 by the prepreg 2. In the process, the circuit board 1 is bound to both sides of the prepreg 2 by locally heating and pressurizing the circuit board in a place shifted so that at least the places of both ends of a plurality of places not less than three along an end edge are not the same positions in a preceding binding operation and a following binding operation. 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SOLUTION: A plurality of circuit boards 1 are laminated via a prepreg 2 by repeating binding operations for binding the circuit board 1 to both sides of the prepreg 2 a plurality of times by partially heat-welding the resin of the prepreg 2 to the circuit board 1 by laminating the circuit boards 1 via the prepreg 2 and by locally heating and pressurizing it in a plurality of places not less than three along an end edge. Thereafter, they are molded by heating and pressurization, and a multilayer printed wiring board is manufactured by laminating and integrating the plurality of circuit boards 1 via an insulation adhesion layer 3 by the prepreg 2. In the process, the circuit board 1 is bound to both sides of the prepreg 2 by locally heating and pressurizing the circuit board in a place shifted so that at least the places of both ends of a plurality of places not less than three along an end edge are not the same positions in a preceding binding operation and a following binding operation. COPYRIGHT: (C)2003,JPO</abstract><edition>7</edition><oa>free_for_read</oa></addata></record> |
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| language | eng |
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| subjects | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS |
| title | MANUFACTURING METHOD OF MULTILAYER PRINTED WIRING BOARD |
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