MANUFACTURING METHOD OF PLASTIC SUBSTRATE HAVING ELECTRIC CIRCUIT
PROBLEM TO BE SOLVED: To provide a manufacturing method of a plastic substrate having an electric circuit capable of forming the electric circuit not by a conventional complicated method but by a simplified method, and realizing the high density of the pattern width and the pattern interval. SOLUTIO...
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| creator | IRIE MASAHIRO HAYASHI SHIGEHIKO KAWAHARA MASATO EKUSA EMIKO |
| description | PROBLEM TO BE SOLVED: To provide a manufacturing method of a plastic substrate having an electric circuit capable of forming the electric circuit not by a conventional complicated method but by a simplified method, and realizing the high density of the pattern width and the pattern interval. SOLUTION: In this manufacturing method of the plastic substrate having the electric circuit, a thin film 11 with metal particles diffused therein is manufacture on the plastic substrate 5, and the thin film 11 is irradiated with laser beam to allow the metal particles coagulated in a groove-like circuit pattern 12 as a core. After the thin film remained in an area not irradiated with the laser beam is removed, the plastic substrate 5 is immersed in an electroless electrolyte, and a plating layer 13 is deposited on the circuit pattern 12 to form an electric circuit. COPYRIGHT: (C)2003,JPO |
| format | Patent |
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SOLUTION: In this manufacturing method of the plastic substrate having the electric circuit, a thin film 11 with metal particles diffused therein is manufacture on the plastic substrate 5, and the thin film 11 is irradiated with laser beam to allow the metal particles coagulated in a groove-like circuit pattern 12 as a core. After the thin film remained in an area not irradiated with the laser beam is removed, the plastic substrate 5 is immersed in an electroless electrolyte, and a plating layer 13 is deposited on the circuit pattern 12 to form an electric circuit. 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SOLUTION: In this manufacturing method of the plastic substrate having the electric circuit, a thin film 11 with metal particles diffused therein is manufacture on the plastic substrate 5, and the thin film 11 is irradiated with laser beam to allow the metal particles coagulated in a groove-like circuit pattern 12 as a core. After the thin film remained in an area not irradiated with the laser beam is removed, the plastic substrate 5 is immersed in an electroless electrolyte, and a plating layer 13 is deposited on the circuit pattern 12 to form an electric circuit. COPYRIGHT: (C)2003,JPO</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>CHEMICAL SURFACE TREATMENT</subject><subject>CHEMISTRY</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING MATERIAL WITH METALLIC MATERIAL</subject><subject>COATING METALLIC MATERIAL</subject><subject>DIFFUSION TREATMENT OF METALLIC MATERIAL</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>METALLURGY</subject><subject>PRINTED CIRCUITS</subject><subject>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2003</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZHD0dfQLdXN0DgkN8vRzV_B1DfHwd1Hwd1MI8HEMDvF0VggOdQoOCXIMcVXwcAwDKXH1cXUOCQLKOHsGOYd6hvAwsKYl5hSn8kJpbgYlN9cQZw_d1IL8-NTigsTk1LzUknivACMDA2NDS2MjExNHY6IUAQBC7yuG</recordid><startdate>20030709</startdate><enddate>20030709</enddate><creator>IRIE MASAHIRO</creator><creator>HAYASHI SHIGEHIKO</creator><creator>KAWAHARA MASATO</creator><creator>EKUSA EMIKO</creator><scope>EVB</scope></search><sort><creationdate>20030709</creationdate><title>MANUFACTURING METHOD OF PLASTIC SUBSTRATE HAVING ELECTRIC CIRCUIT</title><author>IRIE MASAHIRO ; HAYASHI SHIGEHIKO ; KAWAHARA MASATO ; EKUSA EMIKO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2003193244A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2003</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>CHEMICAL SURFACE TREATMENT</topic><topic>CHEMISTRY</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING MATERIAL WITH METALLIC MATERIAL</topic><topic>COATING METALLIC MATERIAL</topic><topic>DIFFUSION TREATMENT OF METALLIC MATERIAL</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>METALLURGY</topic><topic>PRINTED CIRCUITS</topic><topic>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</topic><toplevel>online_resources</toplevel><creatorcontrib>IRIE MASAHIRO</creatorcontrib><creatorcontrib>HAYASHI SHIGEHIKO</creatorcontrib><creatorcontrib>KAWAHARA MASATO</creatorcontrib><creatorcontrib>EKUSA EMIKO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>IRIE MASAHIRO</au><au>HAYASHI SHIGEHIKO</au><au>KAWAHARA MASATO</au><au>EKUSA EMIKO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>MANUFACTURING METHOD OF PLASTIC SUBSTRATE HAVING ELECTRIC CIRCUIT</title><date>2003-07-09</date><risdate>2003</risdate><abstract>PROBLEM TO BE SOLVED: To provide a manufacturing method of a plastic substrate having an electric circuit capable of forming the electric circuit not by a conventional complicated method but by a simplified method, and realizing the high density of the pattern width and the pattern interval. SOLUTION: In this manufacturing method of the plastic substrate having the electric circuit, a thin film 11 with metal particles diffused therein is manufacture on the plastic substrate 5, and the thin film 11 is irradiated with laser beam to allow the metal particles coagulated in a groove-like circuit pattern 12 as a core. After the thin film remained in an area not irradiated with the laser beam is removed, the plastic substrate 5 is immersed in an electroless electrolyte, and a plating layer 13 is deposited on the circuit pattern 12 to form an electric circuit. COPYRIGHT: (C)2003,JPO</abstract><edition>7</edition><oa>free_for_read</oa></addata></record> |
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| subjects | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY PRINTED CIRCUITS SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION |
| title | MANUFACTURING METHOD OF PLASTIC SUBSTRATE HAVING ELECTRIC CIRCUIT |
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