METHOD FOR MANUFACTURING MULTILAYER PRINTED WIRING BOARD
PROBLEM TO BE SOLVED: To provide a manufacturing method which is a manufacturing method wherein a multilayer board is manufactured by pressure molding a laminate and a multilayer printed wiring board is manufactured by working the multilayer board, and can improve alignment precision of positions be...
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| creator | SATO KOJI MORIOKA KAZUNOBU |
| description | PROBLEM TO BE SOLVED: To provide a manufacturing method which is a manufacturing method wherein a multilayer board is manufactured by pressure molding a laminate and a multilayer printed wiring board is manufactured by working the multilayer board, and can improve alignment precision of positions between the respective inner layer materials which positions should correspond to each other. SOLUTION: In this manufacturing method of a multilayer printed wiring board, in each of the inner layer materials, character and mark patterns 4 are formed at positions on the same surface of the inner layer material 1 which positions become almost symmetric to a center 5 of the inner layer material 1. When the forming positions of the character and mark patterns are different every inner layer material and the plural inner layer materials, prepregs and metal foils for forming outer layer circuits are assembled, the character and mark patterns which are formed on the different inner layer materials are arranged on positions which are independent of each other when viewed from above. COPYRIGHT: (C)2003,JPO |
| format | Patent |
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SOLUTION: In this manufacturing method of a multilayer printed wiring board, in each of the inner layer materials, character and mark patterns 4 are formed at positions on the same surface of the inner layer material 1 which positions become almost symmetric to a center 5 of the inner layer material 1. When the forming positions of the character and mark patterns are different every inner layer material and the plural inner layer materials, prepregs and metal foils for forming outer layer circuits are assembled, the character and mark patterns which are formed on the different inner layer materials are arranged on positions which are independent of each other when viewed from above. 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SOLUTION: In this manufacturing method of a multilayer printed wiring board, in each of the inner layer materials, character and mark patterns 4 are formed at positions on the same surface of the inner layer material 1 which positions become almost symmetric to a center 5 of the inner layer material 1. When the forming positions of the character and mark patterns are different every inner layer material and the plural inner layer materials, prepregs and metal foils for forming outer layer circuits are assembled, the character and mark patterns which are formed on the different inner layer materials are arranged on positions which are independent of each other when viewed from above. 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SOLUTION: In this manufacturing method of a multilayer printed wiring board, in each of the inner layer materials, character and mark patterns 4 are formed at positions on the same surface of the inner layer material 1 which positions become almost symmetric to a center 5 of the inner layer material 1. When the forming positions of the character and mark patterns are different every inner layer material and the plural inner layer materials, prepregs and metal foils for forming outer layer circuits are assembled, the character and mark patterns which are formed on the different inner layer materials are arranged on positions which are independent of each other when viewed from above. COPYRIGHT: (C)2003,JPO</abstract><edition>7</edition><oa>free_for_read</oa></addata></record> |
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| language | eng |
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| subjects | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS |
| title | METHOD FOR MANUFACTURING MULTILAYER PRINTED WIRING BOARD |
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