RESIN COMPOSITION AND MOLDED MATERIAL

PROBLEM TO BE SOLVED: To provide a resin composition suppressing the reduction of flexibility such as a bending property and elongation property while improving mechanical strength, heat resistance and linear expansion coefficient at the same time in spite of blending a scale-shaped inorganic filler...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	KAMIFUKU ATSUSHI, ISHII YOSHIAKI, OTSUKA KENJIRO, YASUKI MINORU
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS GENERAL PROCESSES OF COMPOUNDING METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS WORKING-UP
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