METHOD FOR FORMING T-SHAPE GATE ELECTRODE
PROBLEM TO BE SOLVED: To stably form a T-shape gate electrode having a short gate length and a low resistance. SOLUTION: The method for forming the T-shape gate electrode comprises the steps of forming a first photoresist pattern having a first opening 35b including a tapered sidewall, and coating a...
Gespeichert in:
Hauptverfasser: | , |
---|---|
Format: | Patent |
Sprache: | eng |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
container_end_page | |
---|---|
container_issue | |
container_start_page | |
container_title | |
container_volume | |
creator | UMIBE KATSUAKI SANO YOSHIAKI |
description | PROBLEM TO BE SOLVED: To stably form a T-shape gate electrode having a short gate length and a low resistance. SOLUTION: The method for forming the T-shape gate electrode comprises the steps of forming a first photoresist pattern having a first opening 35b including a tapered sidewall, and coating a first metal layer 36 having Schottky characteristics thereon. The method further comprises the steps of then opening to include the first opening, forming a second photoresist pattern 37 having a second opening 37a of an overhanging-like sectional shape at the sidewall, and then coating a second metal layer 39 thereon. The method also comprises a step of then removing the second photoresist pattern and the second metal layer on the pattern by a lifting-off method. The method also comprises the steps of removing the exposed part of the first metal layer by etching with the gate electrode upper part pattern 38a formed as above as a mask, and forming the gate electrode lower pattern 36a. The method also comprises a step of forming a T-shape gate electrode 40 by removing the first resist pattern. |
format | Patent |
fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_JP2003115499A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>JP2003115499A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_JP2003115499A3</originalsourceid><addsrcrecordid>eNrjZND0dQ3x8HdRcPMPAmFfTz93hRDdYA_HAFcFd8cQVwVXH1fnkCB_F1ceBta0xJziVF4ozc2g5OYa4uyhm1qQH59aXJCYnJqXWhLvFWBkYGBsaGhqYmnpaEyUIgBVnySM</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>METHOD FOR FORMING T-SHAPE GATE ELECTRODE</title><source>esp@cenet</source><creator>UMIBE KATSUAKI ; SANO YOSHIAKI</creator><creatorcontrib>UMIBE KATSUAKI ; SANO YOSHIAKI</creatorcontrib><description>PROBLEM TO BE SOLVED: To stably form a T-shape gate electrode having a short gate length and a low resistance. SOLUTION: The method for forming the T-shape gate electrode comprises the steps of forming a first photoresist pattern having a first opening 35b including a tapered sidewall, and coating a first metal layer 36 having Schottky characteristics thereon. The method further comprises the steps of then opening to include the first opening, forming a second photoresist pattern 37 having a second opening 37a of an overhanging-like sectional shape at the sidewall, and then coating a second metal layer 39 thereon. The method also comprises a step of then removing the second photoresist pattern and the second metal layer on the pattern by a lifting-off method. The method also comprises the steps of removing the exposed part of the first metal layer by etching with the gate electrode upper part pattern 38a formed as above as a mask, and forming the gate electrode lower pattern 36a. The method also comprises a step of forming a T-shape gate electrode 40 by removing the first resist pattern.</description><edition>7</edition><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2003</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20030418&DB=EPODOC&CC=JP&NR=2003115499A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,778,883,25547,76298</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20030418&DB=EPODOC&CC=JP&NR=2003115499A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>UMIBE KATSUAKI</creatorcontrib><creatorcontrib>SANO YOSHIAKI</creatorcontrib><title>METHOD FOR FORMING T-SHAPE GATE ELECTRODE</title><description>PROBLEM TO BE SOLVED: To stably form a T-shape gate electrode having a short gate length and a low resistance. SOLUTION: The method for forming the T-shape gate electrode comprises the steps of forming a first photoresist pattern having a first opening 35b including a tapered sidewall, and coating a first metal layer 36 having Schottky characteristics thereon. The method further comprises the steps of then opening to include the first opening, forming a second photoresist pattern 37 having a second opening 37a of an overhanging-like sectional shape at the sidewall, and then coating a second metal layer 39 thereon. The method also comprises a step of then removing the second photoresist pattern and the second metal layer on the pattern by a lifting-off method. The method also comprises the steps of removing the exposed part of the first metal layer by etching with the gate electrode upper part pattern 38a formed as above as a mask, and forming the gate electrode lower pattern 36a. The method also comprises a step of forming a T-shape gate electrode 40 by removing the first resist pattern.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2003</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZND0dQ3x8HdRcPMPAmFfTz93hRDdYA_HAFcFd8cQVwVXH1fnkCB_F1ceBta0xJziVF4ozc2g5OYa4uyhm1qQH59aXJCYnJqXWhLvFWBkYGBsaGhqYmnpaEyUIgBVnySM</recordid><startdate>20030418</startdate><enddate>20030418</enddate><creator>UMIBE KATSUAKI</creator><creator>SANO YOSHIAKI</creator><scope>EVB</scope></search><sort><creationdate>20030418</creationdate><title>METHOD FOR FORMING T-SHAPE GATE ELECTRODE</title><author>UMIBE KATSUAKI ; SANO YOSHIAKI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2003115499A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2003</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>UMIBE KATSUAKI</creatorcontrib><creatorcontrib>SANO YOSHIAKI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>UMIBE KATSUAKI</au><au>SANO YOSHIAKI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>METHOD FOR FORMING T-SHAPE GATE ELECTRODE</title><date>2003-04-18</date><risdate>2003</risdate><abstract>PROBLEM TO BE SOLVED: To stably form a T-shape gate electrode having a short gate length and a low resistance. SOLUTION: The method for forming the T-shape gate electrode comprises the steps of forming a first photoresist pattern having a first opening 35b including a tapered sidewall, and coating a first metal layer 36 having Schottky characteristics thereon. The method further comprises the steps of then opening to include the first opening, forming a second photoresist pattern 37 having a second opening 37a of an overhanging-like sectional shape at the sidewall, and then coating a second metal layer 39 thereon. The method also comprises a step of then removing the second photoresist pattern and the second metal layer on the pattern by a lifting-off method. The method also comprises the steps of removing the exposed part of the first metal layer by etching with the gate electrode upper part pattern 38a formed as above as a mask, and forming the gate electrode lower pattern 36a. The method also comprises a step of forming a T-shape gate electrode 40 by removing the first resist pattern.</abstract><edition>7</edition><oa>free_for_read</oa></addata></record> |
fulltext | fulltext_linktorsrc |
identifier | |
ispartof | |
issn | |
language | eng |
recordid | cdi_epo_espacenet_JP2003115499A |
source | esp@cenet |
subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
title | METHOD FOR FORMING T-SHAPE GATE ELECTRODE |
url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-16T07%3A51%3A22IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=UMIBE%20KATSUAKI&rft.date=2003-04-18&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EJP2003115499A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |