CHEMICALLY AMPLIFYING POSITIVE RADIATION SENSITIVE RESIN COMPOSITION

PROBLEM TO BE SOLVED: To obtain a chemically amplifying positive radiation sensitive resin composition having high sensitivity and high resolution so as to decrease the difference in the resolution of line width in a coarse and fine pattern of a resist in a circuit pattern where both of a coarse pat...

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Bibliographische Detailangaben
Hauptverfasser:	RI TOKAN, HAMADA TAKAHIRO, MIYAZAKI SHINJI
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR BASIC ELECTRIC ELEMENTS CINEMATOGRAPHY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MATERIALS THEREFOR ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To obtain a chemically amplifying positive radiation sensitive resin composition having high sensitivity and high resolution so as to decrease the difference in the resolution of line width in a coarse and fine pattern of a resist in a circuit pattern where both of a coarse pattern and a fine pattern are present. SOLUTION: The chemically amplifying positive radiation sensitive resin composition comprises an alkali-insoluble or alkali hardly soluble resin protected with an acid dissociating protective group and a compound which produces an acid by applying radiation. In this composition, as for the alkali-insoluble or alkali hardly soluble resin protected with an acid dissociating protective group, a resin having >=25 kcal/mol activation energy (ΔE) to dissociate the acid dissociating protective group is used. As to the compound which generates an acid by irradiation of radiation, a mixture of a compound which produces a carboxylic acid by applying radiation and a compound which produces a sulfonic acid by applying radiation is used.