GROUNDING DEVICE

PROBLEM TO BE SOLVED: To provide a grounding device capable of facilitating mounting of a grounding part on an electric circuit board. SOLUTION: This grounding device has at least one of grounding parts 42 and 43 in contact with grounded parts 28 and 30 requiring grounding and a U-shaped spring shap...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: SANO SHIGETO, UCHINO SETSUYA, OHIRA SHIGENORI
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator SANO SHIGETO
UCHINO SETSUYA
OHIRA SHIGENORI
description PROBLEM TO BE SOLVED: To provide a grounding device capable of facilitating mounting of a grounding part on an electric circuit board. SOLUTION: This grounding device has at least one of grounding parts 42 and 43 in contact with grounded parts 28 and 30 requiring grounding and a U-shaped spring shaped clip part 45 holdable at an edge part 44 of the electric circuit board 26. The grounding parts 42 and 43 have contact parts 42a and 43a to contact the grounded parts 28 and 30 on tip sides, and are connected to the clip part 45 on base end sides. The grounding pars 42 and 43 and the clip part 45 are integrally formed by bending a material having elasticity.
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_JP2003077556A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>JP2003077556A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_JP2003077556A3</originalsourceid><addsrcrecordid>eNrjZBBwD_IP9XPx9HNXcHEN83R25WFgTUvMKU7lhdLcDEpuriHOHrqpBfnxqcUFicmpeakl8V4BRgYGxgbm5qamZo7GRCkCADqRHe4</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>GROUNDING DEVICE</title><source>esp@cenet</source><creator>SANO SHIGETO ; UCHINO SETSUYA ; OHIRA SHIGENORI</creator><creatorcontrib>SANO SHIGETO ; UCHINO SETSUYA ; OHIRA SHIGENORI</creatorcontrib><description>PROBLEM TO BE SOLVED: To provide a grounding device capable of facilitating mounting of a grounding part on an electric circuit board. SOLUTION: This grounding device has at least one of grounding parts 42 and 43 in contact with grounded parts 28 and 30 requiring grounding and a U-shaped spring shaped clip part 45 holdable at an edge part 44 of the electric circuit board 26. The grounding parts 42 and 43 have contact parts 42a and 43a to contact the grounded parts 28 and 30 on tip sides, and are connected to the clip part 45 on base end sides. The grounding pars 42 and 43 and the clip part 45 are integrally formed by bending a material having elasticity.</description><edition>7</edition><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; CURRENT COLLECTORS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; LINE CONNECTORS ; NATURALLY-OCCURRING ELECTRICITY ; STATIC ELECTRICITY</subject><creationdate>2003</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20030314&amp;DB=EPODOC&amp;CC=JP&amp;NR=2003077556A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20030314&amp;DB=EPODOC&amp;CC=JP&amp;NR=2003077556A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>SANO SHIGETO</creatorcontrib><creatorcontrib>UCHINO SETSUYA</creatorcontrib><creatorcontrib>OHIRA SHIGENORI</creatorcontrib><title>GROUNDING DEVICE</title><description>PROBLEM TO BE SOLVED: To provide a grounding device capable of facilitating mounting of a grounding part on an electric circuit board. SOLUTION: This grounding device has at least one of grounding parts 42 and 43 in contact with grounded parts 28 and 30 requiring grounding and a U-shaped spring shaped clip part 45 holdable at an edge part 44 of the electric circuit board 26. The grounding parts 42 and 43 have contact parts 42a and 43a to contact the grounded parts 28 and 30 on tip sides, and are connected to the clip part 45 on base end sides. The grounding pars 42 and 43 and the clip part 45 are integrally formed by bending a material having elasticity.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CURRENT COLLECTORS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>LINE CONNECTORS</subject><subject>NATURALLY-OCCURRING ELECTRICITY</subject><subject>STATIC ELECTRICITY</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2003</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZBBwD_IP9XPx9HNXcHEN83R25WFgTUvMKU7lhdLcDEpuriHOHrqpBfnxqcUFicmpeakl8V4BRgYGxgbm5qamZo7GRCkCADqRHe4</recordid><startdate>20030314</startdate><enddate>20030314</enddate><creator>SANO SHIGETO</creator><creator>UCHINO SETSUYA</creator><creator>OHIRA SHIGENORI</creator><scope>EVB</scope></search><sort><creationdate>20030314</creationdate><title>GROUNDING DEVICE</title><author>SANO SHIGETO ; UCHINO SETSUYA ; OHIRA SHIGENORI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2003077556A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2003</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CURRENT COLLECTORS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>LINE CONNECTORS</topic><topic>NATURALLY-OCCURRING ELECTRICITY</topic><topic>STATIC ELECTRICITY</topic><toplevel>online_resources</toplevel><creatorcontrib>SANO SHIGETO</creatorcontrib><creatorcontrib>UCHINO SETSUYA</creatorcontrib><creatorcontrib>OHIRA SHIGENORI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>SANO SHIGETO</au><au>UCHINO SETSUYA</au><au>OHIRA SHIGENORI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>GROUNDING DEVICE</title><date>2003-03-14</date><risdate>2003</risdate><abstract>PROBLEM TO BE SOLVED: To provide a grounding device capable of facilitating mounting of a grounding part on an electric circuit board. SOLUTION: This grounding device has at least one of grounding parts 42 and 43 in contact with grounded parts 28 and 30 requiring grounding and a U-shaped spring shaped clip part 45 holdable at an edge part 44 of the electric circuit board 26. The grounding parts 42 and 43 have contact parts 42a and 43a to contact the grounded parts 28 and 30 on tip sides, and are connected to the clip part 45 on base end sides. The grounding pars 42 and 43 and the clip part 45 are integrally formed by bending a material having elasticity.</abstract><edition>7</edition><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language eng
recordid cdi_epo_espacenet_JP2003077556A
source esp@cenet
subjects BASIC ELECTRIC ELEMENTS
CURRENT COLLECTORS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
LINE CONNECTORS
NATURALLY-OCCURRING ELECTRICITY
STATIC ELECTRICITY
title GROUNDING DEVICE
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-10T08%3A49%3A55IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=SANO%20SHIGETO&rft.date=2003-03-14&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EJP2003077556A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true