APPARATUS AND METHOD FOR SUPPORTING BOARD FROM BENEATH IN ELECTRONIC COMPONENT MOUNTING EQUIPMENT

APPARATUS AND METHOD FOR SUPPORTING BOARD FROM BENEATH IN ELECTRONIC COMPONENT MOUNTING EQUIPMENT

PROBLEM TO BE SOLVED: To provide an apparatus and a method for supporting a board from beneath in electronic component mounting equipment wherein setting-up changing operation is simplified for various kinds of boards. SOLUTION: The apparatus is so designed as to support from beneath the face of a b...

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1. Verfasser: MURAKAMI SHUSAKU
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CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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creator MURAKAMI SHUSAKU
description PROBLEM TO BE SOLVED: To provide an apparatus and a method for supporting a board from beneath in electronic component mounting equipment wherein setting-up changing operation is simplified for various kinds of boards. SOLUTION: The apparatus is so designed as to support from beneath the face of a board 11 already mounted with parts. An underneath support portion 2 which is moved up and down by an elevating mechanism 3 is composed of a container 4 which contains electric viscous fluid 7 therein and whose upper face consists of an elastic membrane 6. When a board 11 is supported, the underneath support portion 2 is moved up to the underside of the board to abut the elastic membrane 6 against the underside of the board 11 and adapt the membrane to the underside of the board 11. A voltage is applied to the electric viscous fluid 7 in the container 4 by electrode members 5, and the board is supported from beneath by the electric viscous fluid 7' with enhanced viscosity. Thus, various kinds of boards can be covered by the same underneath support portion 2, and setting-up changing operation is simplified.
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_JP2003069295A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>JP2003069295A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_JP2003069295A3</originalsourceid><addsrcrecordid>eNqNi0EKwjAQAHvxIOofFu9CqSj0mKZbGzG7a7o5lyLxJFqo_8ciPsDTwDCzzAYjYoLR2IGhGjxqyzU0HKCLIhzU0QkqNmGWgT1USGi0BUeAF7QamJwFy16YkBQ8R_o-eI1O_KzW2eI-PKa0-XGVbRtU2-7S-OrTNA639Ezv_ixFnu_zY1mUB7P_K_oAOD80eQ</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>APPARATUS AND METHOD FOR SUPPORTING BOARD FROM BENEATH IN ELECTRONIC COMPONENT MOUNTING EQUIPMENT</title><source>esp@cenet</source><creator>MURAKAMI SHUSAKU</creator><creatorcontrib>MURAKAMI SHUSAKU</creatorcontrib><description>PROBLEM TO BE SOLVED: To provide an apparatus and a method for supporting a board from beneath in electronic component mounting equipment wherein setting-up changing operation is simplified for various kinds of boards. SOLUTION: The apparatus is so designed as to support from beneath the face of a board 11 already mounted with parts. An underneath support portion 2 which is moved up and down by an elevating mechanism 3 is composed of a container 4 which contains electric viscous fluid 7 therein and whose upper face consists of an elastic membrane 6. When a board 11 is supported, the underneath support portion 2 is moved up to the underside of the board to abut the elastic membrane 6 against the underside of the board 11 and adapt the membrane to the underside of the board 11. A voltage is applied to the electric viscous fluid 7 in the container 4 by electrode members 5, and the board is supported from beneath by the electric viscous fluid 7' with enhanced viscosity. Thus, various kinds of boards can be covered by the same underneath support portion 2, and setting-up changing operation is simplified.</description><edition>7</edition><language>eng</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS</subject><creationdate>2003</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20030307&amp;DB=EPODOC&amp;CC=JP&amp;NR=2003069295A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20030307&amp;DB=EPODOC&amp;CC=JP&amp;NR=2003069295A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>MURAKAMI SHUSAKU</creatorcontrib><title>APPARATUS AND METHOD FOR SUPPORTING BOARD FROM BENEATH IN ELECTRONIC COMPONENT MOUNTING EQUIPMENT</title><description>PROBLEM TO BE SOLVED: To provide an apparatus and a method for supporting a board from beneath in electronic component mounting equipment wherein setting-up changing operation is simplified for various kinds of boards. SOLUTION: The apparatus is so designed as to support from beneath the face of a board 11 already mounted with parts. An underneath support portion 2 which is moved up and down by an elevating mechanism 3 is composed of a container 4 which contains electric viscous fluid 7 therein and whose upper face consists of an elastic membrane 6. When a board 11 is supported, the underneath support portion 2 is moved up to the underside of the board to abut the elastic membrane 6 against the underside of the board 11 and adapt the membrane to the underside of the board 11. A voltage is applied to the electric viscous fluid 7 in the container 4 by electrode members 5, and the board is supported from beneath by the electric viscous fluid 7' with enhanced viscosity. Thus, various kinds of boards can be covered by the same underneath support portion 2, and setting-up changing operation is simplified.</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2003</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNi0EKwjAQAHvxIOofFu9CqSj0mKZbGzG7a7o5lyLxJFqo_8ciPsDTwDCzzAYjYoLR2IGhGjxqyzU0HKCLIhzU0QkqNmGWgT1USGi0BUeAF7QamJwFy16YkBQ8R_o-eI1O_KzW2eI-PKa0-XGVbRtU2-7S-OrTNA639Ezv_ixFnu_zY1mUB7P_K_oAOD80eQ</recordid><startdate>20030307</startdate><enddate>20030307</enddate><creator>MURAKAMI SHUSAKU</creator><scope>EVB</scope></search><sort><creationdate>20030307</creationdate><title>APPARATUS AND METHOD FOR SUPPORTING BOARD FROM BENEATH IN ELECTRONIC COMPONENT MOUNTING EQUIPMENT</title><author>MURAKAMI SHUSAKU</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2003069295A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2003</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><toplevel>online_resources</toplevel><creatorcontrib>MURAKAMI SHUSAKU</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>MURAKAMI SHUSAKU</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>APPARATUS AND METHOD FOR SUPPORTING BOARD FROM BENEATH IN ELECTRONIC COMPONENT MOUNTING EQUIPMENT</title><date>2003-03-07</date><risdate>2003</risdate><abstract>PROBLEM TO BE SOLVED: To provide an apparatus and a method for supporting a board from beneath in electronic component mounting equipment wherein setting-up changing operation is simplified for various kinds of boards. SOLUTION: The apparatus is so designed as to support from beneath the face of a board 11 already mounted with parts. An underneath support portion 2 which is moved up and down by an elevating mechanism 3 is composed of a container 4 which contains electric viscous fluid 7 therein and whose upper face consists of an elastic membrane 6. When a board 11 is supported, the underneath support portion 2 is moved up to the underside of the board to abut the elastic membrane 6 against the underside of the board 11 and adapt the membrane to the underside of the board 11. A voltage is applied to the electric viscous fluid 7 in the container 4 by electrode members 5, and the board is supported from beneath by the electric viscous fluid 7' with enhanced viscosity. Thus, various kinds of boards can be covered by the same underneath support portion 2, and setting-up changing operation is simplified.</abstract><edition>7</edition><oa>free_for_read</oa></addata></record>
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subjects CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
title APPARATUS AND METHOD FOR SUPPORTING BOARD FROM BENEATH IN ELECTRONIC COMPONENT MOUNTING EQUIPMENT
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-03T16%3A48%3A38IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=MURAKAMI%20SHUSAKU&rft.date=2003-03-07&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EJP2003069295A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true