SEALING STRUCTURE OF MULTI-CHIP MODULE

PROBLEM TO BE SOLVED: To provide a multi-chip module sealing structure which is superior in cooling performance and sealing reliability. SOLUTION: A semiconductor device 2 is mounted on a wiring board 1, the top surface of the wiring board 1 is fixed by soldering 8 to the undersurfaces of first fram...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	YASUDA AKIHIRO, KOYANO KOICHI, TAKAHASHI KOICHI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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