SEALING STRUCTURE OF MULTI-CHIP MODULE
PROBLEM TO BE SOLVED: To provide a multi-chip module sealing structure which is superior in cooling performance and sealing reliability. SOLUTION: A semiconductor device 2 is mounted on a wiring board 1, the top surface of the wiring board 1 is fixed by soldering 8 to the undersurfaces of first fram...
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| creator | YASUDA AKIHIRO KOYANO KOICHI TAKAHASHI KOICHI |
| description | PROBLEM TO BE SOLVED: To provide a multi-chip module sealing structure which is superior in cooling performance and sealing reliability. SOLUTION: A semiconductor device 2 is mounted on a wiring board 1, the top surface of the wiring board 1 is fixed by soldering 8 to the undersurfaces of first frames 5 of which each thermal expansion coefficient conforms to that of the wiring board 1. Each of the upper parts of the first frames 5 is extended outside of the edges of the wiring board 1, the lower part of the air-cooling heat sink 7 and the top surfaces of the second frames 10 are fastened by bolts 9 through the intermediary of an O-ring between a large air-cooling heat sink 7 covering the frames 5 sufficiently and the first frames 5, and through the intermediary of plastic pieces 6 between the inner middle stages of second frames 10 of which each thermal expansion coefficient conforms to that of the air-cooling heat sink 7 and the outer middle stage of the first frames 5. |
| format | Patent |
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Each of the upper parts of the first frames 5 is extended outside of the edges of the wiring board 1, the lower part of the air-cooling heat sink 7 and the top surfaces of the second frames 10 are fastened by bolts 9 through the intermediary of an O-ring between a large air-cooling heat sink 7 covering the frames 5 sufficiently and the first frames 5, and through the intermediary of plastic pieces 6 between the inner middle stages of second frames 10 of which each thermal expansion coefficient conforms to that of the air-cooling heat sink 7 and the outer middle stage of the first frames 5.</description><edition>7</edition><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS ; SEMICONDUCTOR DEVICES</subject><creationdate>2003</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20030307&DB=EPODOC&CC=JP&NR=2003068969A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25555,76308</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20030307&DB=EPODOC&CC=JP&NR=2003068969A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>YASUDA AKIHIRO</creatorcontrib><creatorcontrib>KOYANO KOICHI</creatorcontrib><creatorcontrib>TAKAHASHI KOICHI</creatorcontrib><title>SEALING STRUCTURE OF MULTI-CHIP MODULE</title><description>PROBLEM TO BE SOLVED: To provide a multi-chip module sealing structure which is superior in cooling performance and sealing reliability. 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| subjects | BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES |
| title | SEALING STRUCTURE OF MULTI-CHIP MODULE |
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