RESIN COMPOSITION FOR CLEANING MOLD AND MOLDING MATERIAL FOR TRANSFER PRESS MOLD
PROBLEM TO BE SOLVED: To provide a resin composition for cleaning a mold which is excellent in fluidity and packing properties in a small void in the mold and in a gate part of a small area. SOLUTION: The resin composition contains an amino resin and mineral powder. In the mineral powder, the maximu...
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| creator | SAWANO SHIN |
| description | PROBLEM TO BE SOLVED: To provide a resin composition for cleaning a mold which is excellent in fluidity and packing properties in a small void in the mold and in a gate part of a small area. SOLUTION: The resin composition contains an amino resin and mineral powder. In the mineral powder, the maximum particle size of particles is 180 μm or below, and the content of particles at least 100 μm in particle size in the powder is 1 mass% or below. In addition, the composition contains 5-30 mass% of the mineral powder. |
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SOLUTION: The resin composition contains an amino resin and mineral powder. In the mineral powder, the maximum particle size of particles is 180 μm or below, and the content of particles at least 100 μm in particle size in the powder is 1 mass% or below. 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SOLUTION: The resin composition contains an amino resin and mineral powder. In the mineral powder, the maximum particle size of particles is 180 μm or below, and the content of particles at least 100 μm in particle size in the powder is 1 mass% or below. In addition, the composition contains 5-30 mass% of the mineral powder.</abstract><edition>7</edition><oa>free_for_read</oa></addata></record> |
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| subjects | AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL |
| title | RESIN COMPOSITION FOR CLEANING MOLD AND MOLDING MATERIAL FOR TRANSFER PRESS MOLD |
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