SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To satisfy guaranteed temperature of semiconductor chips in a semiconductor device, having a constitution where both faces of the semiconductor chips are electrically connected to a conductor member. SOLUTION: The guaranteed temperatures of the semiconductor chips 1 and 2 are s...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	HIRANO NAOHIKO, TEJIMA TAKANORI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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