METHOD OF MOUNTING ELECTRONIC COMPONENT HAVING BUMP

PROBLEM TO BE SOLVED: To provide a method of mounting an electronic component having bumps with which highly reliable mounting can be made without damaging the electronic component. SOLUTION: This method of mounting an electronic component 4 having bumps on a substrate comprises a transfer step in w...

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Bibliographische Detailangaben

1. Verfasser:	MATSUO TOSHIKAZU
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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