METHOD OF MOUNTING ELECTRONIC COMPONENT HAVING BUMP
PROBLEM TO BE SOLVED: To provide a method of mounting an electronic component having bumps with which highly reliable mounting can be made without damaging the electronic component. SOLUTION: This method of mounting an electronic component 4 having bumps on a substrate comprises a transfer step in w...
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| creator | MATSUO TOSHIKAZU |
| description | PROBLEM TO BE SOLVED: To provide a method of mounting an electronic component having bumps with which highly reliable mounting can be made without damaging the electronic component. SOLUTION: This method of mounting an electronic component 4 having bumps on a substrate comprises a transfer step in which flux is transferred to solder bumps 4a by descending the electronic component 4 having bumps held under a transfer head 10 to a flux film 19a, which coats a flat surface 13a of a flux supply member 5 with a specified film thickness, and thereafter ascending. In the transfer step, the transfer head 10 presses the solder bumps 4a to the flat surface 13a, which is composed of an abrasion-resistant coating material 13, while the transfer head 10 is moved horizontally in a reciprocal manner, parallel to the pressed surface, to polish the solder bumps 4a for flattening which uniformizes the heights of the lower faces of the solder bumps 4a. Thereby, the load required for the flattening decreases, and the damage to the electronic component is reduced. |
| format | Patent |
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SOLUTION: This method of mounting an electronic component 4 having bumps on a substrate comprises a transfer step in which flux is transferred to solder bumps 4a by descending the electronic component 4 having bumps held under a transfer head 10 to a flux film 19a, which coats a flat surface 13a of a flux supply member 5 with a specified film thickness, and thereafter ascending. In the transfer step, the transfer head 10 presses the solder bumps 4a to the flat surface 13a, which is composed of an abrasion-resistant coating material 13, while the transfer head 10 is moved horizontally in a reciprocal manner, parallel to the pressed surface, to polish the solder bumps 4a for flattening which uniformizes the heights of the lower faces of the solder bumps 4a. 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SOLUTION: This method of mounting an electronic component 4 having bumps on a substrate comprises a transfer step in which flux is transferred to solder bumps 4a by descending the electronic component 4 having bumps held under a transfer head 10 to a flux film 19a, which coats a flat surface 13a of a flux supply member 5 with a specified film thickness, and thereafter ascending. In the transfer step, the transfer head 10 presses the solder bumps 4a to the flat surface 13a, which is composed of an abrasion-resistant coating material 13, while the transfer head 10 is moved horizontally in a reciprocal manner, parallel to the pressed surface, to polish the solder bumps 4a for flattening which uniformizes the heights of the lower faces of the solder bumps 4a. 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SOLUTION: This method of mounting an electronic component 4 having bumps on a substrate comprises a transfer step in which flux is transferred to solder bumps 4a by descending the electronic component 4 having bumps held under a transfer head 10 to a flux film 19a, which coats a flat surface 13a of a flux supply member 5 with a specified film thickness, and thereafter ascending. In the transfer step, the transfer head 10 presses the solder bumps 4a to the flat surface 13a, which is composed of an abrasion-resistant coating material 13, while the transfer head 10 is moved horizontally in a reciprocal manner, parallel to the pressed surface, to polish the solder bumps 4a for flattening which uniformizes the heights of the lower faces of the solder bumps 4a. Thereby, the load required for the flattening decreases, and the damage to the electronic component is reduced.</abstract><edition>7</edition><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES |
| title | METHOD OF MOUNTING ELECTRONIC COMPONENT HAVING BUMP |
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