PACKAGE FOR STORING SEMICONDUCTOR ELEMENT

PROBLEM TO BE SOLVED: To solve the problems of heat produced during operation of a semicon ductor element being not efficiently dissipated to the outside, and a thermal breakdown occurring in a semiconductor element. SOLUTION: The package for storing the semiconductor element consists of a base body...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	MATSUDA SHIN, MATSUZONO SEIGO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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