EXPOSURE DEVICE AND EXPOSURE METHOD USING THE SAME

PROBLEM TO BE SOLVED: To provide an exposure device and exposure method with which the detection and removal of the dust on both front and rear surfaces of a substrate coated with a photoresist can be performed without degrading productivity, the occurrence of a defective substrate requiring regener...

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description PROBLEM TO BE SOLVED: To provide an exposure device and exposure method with which the detection and removal of the dust on both front and rear surfaces of a substrate coated with a photoresist can be performed without degrading productivity, the occurrence of a defective substrate requiring regeneration treatment in photoresist patterns can be reduced and the yield in pattern formation can be improved. SOLUTION: The substrate 7 is conveyed to a dust detecting mechanism section 10 before undergoing exposure processing and both surfaces of the substrate are simultaneously irradiated with belt-like light 15 emitted from light exit ports 13 installed on both the front and rear sides of the substrate 7. The pickup of the dust on both the front and rear surfaces of the substrate 7 is then simultaneously detected. The substrate 7 with which the dust is detected is conveyed to a dust removing mechanism section 20 where the dust is blown off by an ion high-pressure gaseous stream and the blown off dust is sucked and discharged from a discharge port 22, by which both the front and rear surfaces of the substrate are simultaneously subjected to the dust removal treatment.
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SOLUTION: The substrate 7 is conveyed to a dust detecting mechanism section 10 before undergoing exposure processing and both surfaces of the substrate are simultaneously irradiated with belt-like light 15 emitted from light exit ports 13 installed on both the front and rear sides of the substrate 7. The pickup of the dust on both the front and rear surfaces of the substrate 7 is then simultaneously detected. The substrate 7 with which the dust is detected is conveyed to a dust removing mechanism section 20 where the dust is blown off by an ion high-pressure gaseous stream and the blown off dust is sucked and discharged from a discharge port 22, by which both the front and rear surfaces of the substrate are simultaneously subjected to the dust removal treatment.</description><edition>7</edition><language>eng</language><subject>APPARATUS SPECIALLY ADAPTED THEREFOR ; BASIC ELECTRIC ELEMENTS ; CINEMATOGRAPHY ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; ELECTROGRAPHY ; HOLOGRAPHY ; MATERIALS THEREFOR ; ORIGINALS THEREFOR ; PHOTOGRAPHY ; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES ; PHYSICS ; SEMICONDUCTOR DEVICES</subject><creationdate>2002</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20021226&amp;DB=EPODOC&amp;CC=JP&amp;NR=2002372789A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76293</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20021226&amp;DB=EPODOC&amp;CC=JP&amp;NR=2002372789A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>TODO JUNICHI</creatorcontrib><title>EXPOSURE DEVICE AND EXPOSURE METHOD USING THE SAME</title><description>PROBLEM TO BE SOLVED: To provide an exposure device and exposure method with which the detection and removal of the dust on both front and rear surfaces of a substrate coated with a photoresist can be performed without degrading productivity, the occurrence of a defective substrate requiring regeneration treatment in photoresist patterns can be reduced and the yield in pattern formation can be improved. 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SOLUTION: The substrate 7 is conveyed to a dust detecting mechanism section 10 before undergoing exposure processing and both surfaces of the substrate are simultaneously irradiated with belt-like light 15 emitted from light exit ports 13 installed on both the front and rear sides of the substrate 7. The pickup of the dust on both the front and rear surfaces of the substrate 7 is then simultaneously detected. The substrate 7 with which the dust is detected is conveyed to a dust removing mechanism section 20 where the dust is blown off by an ion high-pressure gaseous stream and the blown off dust is sucked and discharged from a discharge port 22, by which both the front and rear surfaces of the substrate are simultaneously subjected to the dust removal treatment.</abstract><edition>7</edition><oa>free_for_read</oa></addata></record>
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subjects APPARATUS SPECIALLY ADAPTED THEREFOR
BASIC ELECTRIC ELEMENTS
CINEMATOGRAPHY
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
ELECTROGRAPHY
HOLOGRAPHY
MATERIALS THEREFOR
ORIGINALS THEREFOR
PHOTOGRAPHY
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES
PHYSICS
SEMICONDUCTOR DEVICES
title EXPOSURE DEVICE AND EXPOSURE METHOD USING THE SAME
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