SOLDERING METHOD

PROBLEM TO BE SOLVED: To improve the soldering quality of lead insertion parts while change points from a conventional process are considerably reduced as much as possible in the soldering of the lead insertion parts. SOLUTION: A plate 1 where subsided part 5 are arranged opposite to the lead parts...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	HATAKEYAMA AKIHITO, WATANABE MASAKI
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS PRINTED CIRCUITS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To improve the soldering quality of lead insertion parts while change points from a conventional process are considerably reduced as much as possible in the soldering of the lead insertion parts. SOLUTION: A plate 1 where subsided part 5 are arranged opposite to the lead parts 3a of the lead insertion parts 3 is filled with solder paste 4. The printed wiring board 2 into which the lead insertion parts 3 are inserted is loaded on the plate 1 and the plate 1 itself is heated. Then, solder paste 4 is melted and soldering is performed.