METHOD AND DEVICE FOR MANUFACTURING SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To overcome such a problem that the footprint increases and the maintenance cost increases as the size of a substrate increases because a channel doping device is employed for adding an impurity element to a channel part, and the problem that the crystal structure is broken whe...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: ICHIJO MITSUHIRO, SAITO HIDEO, ASAMI TAKEOMI
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To overcome such a problem that the footprint increases and the maintenance cost increases as the size of a substrate increases because a channel doping device is employed for adding an impurity element to a channel part, and the problem that the crystal structure is broken when a crystalline semicon ductor film is subjected to doping. SOLUTION: Plasma is generated in a reaction chamber having an electrode using Ni and B as a material and an amorphous semiconductor film is exposed to the plasma thus adding a catalytic element for accelerating crystallization and an impurity element for imparting p-type required for attaining a desired threshold to the amorphous semiconductor film.