METHOD AND DEVICE FOR MANUFACTURING SEMICONDUCTOR DEVICE
PROBLEM TO BE SOLVED: To overcome such a problem that the footprint increases and the maintenance cost increases as the size of a substrate increases because a channel doping device is employed for adding an impurity element to a channel part, and the problem that the crystal structure is broken whe...
Gespeichert in:
Hauptverfasser: | , , |
---|---|
Format: | Patent |
Sprache: | eng |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Zusammenfassung: | PROBLEM TO BE SOLVED: To overcome such a problem that the footprint increases and the maintenance cost increases as the size of a substrate increases because a channel doping device is employed for adding an impurity element to a channel part, and the problem that the crystal structure is broken when a crystalline semicon ductor film is subjected to doping. SOLUTION: Plasma is generated in a reaction chamber having an electrode using Ni and B as a material and an amorphous semiconductor film is exposed to the plasma thus adding a catalytic element for accelerating crystallization and an impurity element for imparting p-type required for attaining a desired threshold to the amorphous semiconductor film. |
---|