HEAT-TREATING EQUIPMENT

PROBLEM TO BE SOLVED: To provide a heat-treating equipment which can improve the uniform ity of the temperature within the plane of a work to be treated and eliminate the remaining treating gas. SOLUTION: The heat-treating equipment heat-treats the work W to be treated which is mounted on a mount ba...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
1. Verfasser: USHIGAWA HARUNORI
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator USHIGAWA HARUNORI
description PROBLEM TO BE SOLVED: To provide a heat-treating equipment which can improve the uniform ity of the temperature within the plane of a work to be treated and eliminate the remaining treating gas. SOLUTION: The heat-treating equipment heat-treats the work W to be treated which is mounted on a mount base 28 as specified while supplying the treating gas from a shower head part 64 provide at the ceiling part of a treating container 22. Further, the equipment is provided with a morphological coefficient improving member 66 which improves the morphological coefficient to the mount base on the outer peripheral side of the shower head part. Consequently, the temperature uniformity within the plane of he work is improved to eliminate the the remaining treating gas.
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_JP2002343779A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>JP2002343779A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_JP2002343779A3</originalsourceid><addsrcrecordid>eNrjZBD3cHUM0Q0JApKefu4KroGhngG-rn4hPAysaYk5xam8UJqbQcnNNcTZQze1ID8-tbggMTk1L7Uk3ivAyMDAyNjE2Nzc0tGYKEUAG1IgAQ</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>HEAT-TREATING EQUIPMENT</title><source>esp@cenet</source><creator>USHIGAWA HARUNORI</creator><creatorcontrib>USHIGAWA HARUNORI</creatorcontrib><description>PROBLEM TO BE SOLVED: To provide a heat-treating equipment which can improve the uniform ity of the temperature within the plane of a work to be treated and eliminate the remaining treating gas. SOLUTION: The heat-treating equipment heat-treats the work W to be treated which is mounted on a mount base 28 as specified while supplying the treating gas from a shower head part 64 provide at the ceiling part of a treating container 22. Further, the equipment is provided with a morphological coefficient improving member 66 which improves the morphological coefficient to the mount base on the outer peripheral side of the shower head part. Consequently, the temperature uniformity within the plane of he work is improved to eliminate the the remaining treating gas.</description><edition>7</edition><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; CHEMICAL SURFACE TREATMENT ; CHEMISTRY ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING MATERIAL WITH METALLIC MATERIAL ; COATING METALLIC MATERIAL ; DIFFUSION TREATMENT OF METALLIC MATERIAL ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL ; METALLURGY ; SEMICONDUCTOR DEVICES ; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><creationdate>2002</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20021129&amp;DB=EPODOC&amp;CC=JP&amp;NR=2002343779A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20021129&amp;DB=EPODOC&amp;CC=JP&amp;NR=2002343779A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>USHIGAWA HARUNORI</creatorcontrib><title>HEAT-TREATING EQUIPMENT</title><description>PROBLEM TO BE SOLVED: To provide a heat-treating equipment which can improve the uniform ity of the temperature within the plane of a work to be treated and eliminate the remaining treating gas. SOLUTION: The heat-treating equipment heat-treats the work W to be treated which is mounted on a mount base 28 as specified while supplying the treating gas from a shower head part 64 provide at the ceiling part of a treating container 22. Further, the equipment is provided with a morphological coefficient improving member 66 which improves the morphological coefficient to the mount base on the outer peripheral side of the shower head part. Consequently, the temperature uniformity within the plane of he work is improved to eliminate the the remaining treating gas.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CHEMICAL SURFACE TREATMENT</subject><subject>CHEMISTRY</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING MATERIAL WITH METALLIC MATERIAL</subject><subject>COATING METALLIC MATERIAL</subject><subject>DIFFUSION TREATMENT OF METALLIC MATERIAL</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</subject><subject>METALLURGY</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2002</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZBD3cHUM0Q0JApKefu4KroGhngG-rn4hPAysaYk5xam8UJqbQcnNNcTZQze1ID8-tbggMTk1L7Uk3ivAyMDAyNjE2Nzc0tGYKEUAG1IgAQ</recordid><startdate>20021129</startdate><enddate>20021129</enddate><creator>USHIGAWA HARUNORI</creator><scope>EVB</scope></search><sort><creationdate>20021129</creationdate><title>HEAT-TREATING EQUIPMENT</title><author>USHIGAWA HARUNORI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2002343779A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2002</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CHEMICAL SURFACE TREATMENT</topic><topic>CHEMISTRY</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING MATERIAL WITH METALLIC MATERIAL</topic><topic>COATING METALLIC MATERIAL</topic><topic>DIFFUSION TREATMENT OF METALLIC MATERIAL</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</topic><topic>METALLURGY</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</topic><toplevel>online_resources</toplevel><creatorcontrib>USHIGAWA HARUNORI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>USHIGAWA HARUNORI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>HEAT-TREATING EQUIPMENT</title><date>2002-11-29</date><risdate>2002</risdate><abstract>PROBLEM TO BE SOLVED: To provide a heat-treating equipment which can improve the uniform ity of the temperature within the plane of a work to be treated and eliminate the remaining treating gas. SOLUTION: The heat-treating equipment heat-treats the work W to be treated which is mounted on a mount base 28 as specified while supplying the treating gas from a shower head part 64 provide at the ceiling part of a treating container 22. Further, the equipment is provided with a morphological coefficient improving member 66 which improves the morphological coefficient to the mount base on the outer peripheral side of the shower head part. Consequently, the temperature uniformity within the plane of he work is improved to eliminate the the remaining treating gas.</abstract><edition>7</edition><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language eng
recordid cdi_epo_espacenet_JP2002343779A
source esp@cenet
subjects BASIC ELECTRIC ELEMENTS
CHEMICAL SURFACE TREATMENT
CHEMISTRY
COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
COATING MATERIAL WITH METALLIC MATERIAL
COATING METALLIC MATERIAL
DIFFUSION TREATMENT OF METALLIC MATERIAL
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL
METALLURGY
SEMICONDUCTOR DEVICES
SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
title HEAT-TREATING EQUIPMENT
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-20T17%3A30%3A13IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=USHIGAWA%20HARUNORI&rft.date=2002-11-29&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EJP2002343779A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true