HEAT-TREATING EQUIPMENT
PROBLEM TO BE SOLVED: To provide a heat-treating equipment which can improve the uniform ity of the temperature within the plane of a work to be treated and eliminate the remaining treating gas. SOLUTION: The heat-treating equipment heat-treats the work W to be treated which is mounted on a mount ba...
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creator | USHIGAWA HARUNORI |
description | PROBLEM TO BE SOLVED: To provide a heat-treating equipment which can improve the uniform ity of the temperature within the plane of a work to be treated and eliminate the remaining treating gas. SOLUTION: The heat-treating equipment heat-treats the work W to be treated which is mounted on a mount base 28 as specified while supplying the treating gas from a shower head part 64 provide at the ceiling part of a treating container 22. Further, the equipment is provided with a morphological coefficient improving member 66 which improves the morphological coefficient to the mount base on the outer peripheral side of the shower head part. Consequently, the temperature uniformity within the plane of he work is improved to eliminate the the remaining treating gas. |
format | Patent |
fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_JP2002343779A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>JP2002343779A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_JP2002343779A3</originalsourceid><addsrcrecordid>eNrjZBD3cHUM0Q0JApKefu4KroGhngG-rn4hPAysaYk5xam8UJqbQcnNNcTZQze1ID8-tbggMTk1L7Uk3ivAyMDAyNjE2Nzc0tGYKEUAG1IgAQ</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>HEAT-TREATING EQUIPMENT</title><source>esp@cenet</source><creator>USHIGAWA HARUNORI</creator><creatorcontrib>USHIGAWA HARUNORI</creatorcontrib><description>PROBLEM TO BE SOLVED: To provide a heat-treating equipment which can improve the uniform ity of the temperature within the plane of a work to be treated and eliminate the remaining treating gas. SOLUTION: The heat-treating equipment heat-treats the work W to be treated which is mounted on a mount base 28 as specified while supplying the treating gas from a shower head part 64 provide at the ceiling part of a treating container 22. Further, the equipment is provided with a morphological coefficient improving member 66 which improves the morphological coefficient to the mount base on the outer peripheral side of the shower head part. Consequently, the temperature uniformity within the plane of he work is improved to eliminate the the remaining treating gas.</description><edition>7</edition><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; CHEMICAL SURFACE TREATMENT ; CHEMISTRY ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING MATERIAL WITH METALLIC MATERIAL ; COATING METALLIC MATERIAL ; DIFFUSION TREATMENT OF METALLIC MATERIAL ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL ; METALLURGY ; SEMICONDUCTOR DEVICES ; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><creationdate>2002</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20021129&DB=EPODOC&CC=JP&NR=2002343779A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20021129&DB=EPODOC&CC=JP&NR=2002343779A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>USHIGAWA HARUNORI</creatorcontrib><title>HEAT-TREATING EQUIPMENT</title><description>PROBLEM TO BE SOLVED: To provide a heat-treating equipment which can improve the uniform ity of the temperature within the plane of a work to be treated and eliminate the remaining treating gas. SOLUTION: The heat-treating equipment heat-treats the work W to be treated which is mounted on a mount base 28 as specified while supplying the treating gas from a shower head part 64 provide at the ceiling part of a treating container 22. Further, the equipment is provided with a morphological coefficient improving member 66 which improves the morphological coefficient to the mount base on the outer peripheral side of the shower head part. Consequently, the temperature uniformity within the plane of he work is improved to eliminate the the remaining treating gas.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CHEMICAL SURFACE TREATMENT</subject><subject>CHEMISTRY</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING MATERIAL WITH METALLIC MATERIAL</subject><subject>COATING METALLIC MATERIAL</subject><subject>DIFFUSION TREATMENT OF METALLIC MATERIAL</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</subject><subject>METALLURGY</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2002</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZBD3cHUM0Q0JApKefu4KroGhngG-rn4hPAysaYk5xam8UJqbQcnNNcTZQze1ID8-tbggMTk1L7Uk3ivAyMDAyNjE2Nzc0tGYKEUAG1IgAQ</recordid><startdate>20021129</startdate><enddate>20021129</enddate><creator>USHIGAWA HARUNORI</creator><scope>EVB</scope></search><sort><creationdate>20021129</creationdate><title>HEAT-TREATING EQUIPMENT</title><author>USHIGAWA HARUNORI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2002343779A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2002</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CHEMICAL SURFACE TREATMENT</topic><topic>CHEMISTRY</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING MATERIAL WITH METALLIC MATERIAL</topic><topic>COATING METALLIC MATERIAL</topic><topic>DIFFUSION TREATMENT OF METALLIC MATERIAL</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</topic><topic>METALLURGY</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</topic><toplevel>online_resources</toplevel><creatorcontrib>USHIGAWA HARUNORI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>USHIGAWA HARUNORI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>HEAT-TREATING EQUIPMENT</title><date>2002-11-29</date><risdate>2002</risdate><abstract>PROBLEM TO BE SOLVED: To provide a heat-treating equipment which can improve the uniform ity of the temperature within the plane of a work to be treated and eliminate the remaining treating gas. SOLUTION: The heat-treating equipment heat-treats the work W to be treated which is mounted on a mount base 28 as specified while supplying the treating gas from a shower head part 64 provide at the ceiling part of a treating container 22. Further, the equipment is provided with a morphological coefficient improving member 66 which improves the morphological coefficient to the mount base on the outer peripheral side of the shower head part. Consequently, the temperature uniformity within the plane of he work is improved to eliminate the the remaining treating gas.</abstract><edition>7</edition><oa>free_for_read</oa></addata></record> |
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subjects | BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SEMICONDUCTOR DEVICES SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION |
title | HEAT-TREATING EQUIPMENT |
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