WAFER TRANSFER APPARATUS AND TRANSFER METHOD

PROBLEM TO BE SOLVED: To provide a wafer transfer apparatus and a method which can reduce a stress to a wafer, realizes simplification of the apparatus, and the temperature variation of the wafer is little. SOLUTION: The wafer transfer apparatus is equipped with heat stages 20, 21, 22 on upper surfa...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: MOROE HIROBUMI, KOMACHI YASUYUKI
Format: Patent
Sprache:eng
Schlagworte:
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