WAFER TRANSFER APPARATUS AND TRANSFER METHOD
PROBLEM TO BE SOLVED: To provide a wafer transfer apparatus and a method which can reduce a stress to a wafer, realizes simplification of the apparatus, and the temperature variation of the wafer is little. SOLUTION: The wafer transfer apparatus is equipped with heat stages 20, 21, 22 on upper surfa...
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| creator | MOROE HIROBUMI KOMACHI YASUYUKI |
| description | PROBLEM TO BE SOLVED: To provide a wafer transfer apparatus and a method which can reduce a stress to a wafer, realizes simplification of the apparatus, and the temperature variation of the wafer is little. SOLUTION: The wafer transfer apparatus is equipped with heat stages 20, 21, 22 on upper surfaces of which grooved channels 23 parallel in a direction A of transferring wafer are formed, pawls 35 inserted into the grooved channels 23, and a transfer means which holds the pawls 35, moves them up/down, and removes them in a direction of transferring. An inclined plane 35a is formed at a tip of the pawl 35 in the transfer direction, the inclined planes 35a are formed so as to extrude little over the heat stages 20, 21, 22 when the pawls 35 are positioned in the grooved channels 23. |
| format | Patent |
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SOLUTION: The wafer transfer apparatus is equipped with heat stages 20, 21, 22 on upper surfaces of which grooved channels 23 parallel in a direction A of transferring wafer are formed, pawls 35 inserted into the grooved channels 23, and a transfer means which holds the pawls 35, moves them up/down, and removes them in a direction of transferring. An inclined plane 35a is formed at a tip of the pawl 35 in the transfer direction, the inclined planes 35a are formed so as to extrude little over the heat stages 20, 21, 22 when the pawls 35 are positioned in the grooved channels 23.</description><edition>7</edition><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; CONVEYING ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; HANDLING THIN OR FILAMENTARY MATERIAL ; PACKING ; PERFORMING OPERATIONS ; PNEUMATIC TUBE CONVEYORS ; SEMICONDUCTOR DEVICES ; SHOP CONVEYOR SYSTEMS ; STORING ; TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING ORTIPPING ; TRANSPORTING</subject><creationdate>2002</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20021115&DB=EPODOC&CC=JP&NR=2002329764A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76516</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20021115&DB=EPODOC&CC=JP&NR=2002329764A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>MOROE HIROBUMI</creatorcontrib><creatorcontrib>KOMACHI YASUYUKI</creatorcontrib><title>WAFER TRANSFER APPARATUS AND TRANSFER METHOD</title><description>PROBLEM TO BE SOLVED: To provide a wafer transfer apparatus and a method which can reduce a stress to a wafer, realizes simplification of the apparatus, and the temperature variation of the wafer is little. 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SOLUTION: The wafer transfer apparatus is equipped with heat stages 20, 21, 22 on upper surfaces of which grooved channels 23 parallel in a direction A of transferring wafer are formed, pawls 35 inserted into the grooved channels 23, and a transfer means which holds the pawls 35, moves them up/down, and removes them in a direction of transferring. An inclined plane 35a is formed at a tip of the pawl 35 in the transfer direction, the inclined planes 35a are formed so as to extrude little over the heat stages 20, 21, 22 when the pawls 35 are positioned in the grooved channels 23.</abstract><edition>7</edition><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS CONVEYING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY HANDLING THIN OR FILAMENTARY MATERIAL PACKING PERFORMING OPERATIONS PNEUMATIC TUBE CONVEYORS SEMICONDUCTOR DEVICES SHOP CONVEYOR SYSTEMS STORING TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING ORTIPPING TRANSPORTING |
| title | WAFER TRANSFER APPARATUS AND TRANSFER METHOD |
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