SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
PROBLEM TO BE SOLVED: To simplify a configuration of a mold die used in resin molding, prevent damages of a heat generating element, and eliminate a configuration for insulating. SOLUTION: The semiconductor of the present invention is configured such that the resin mold is performed in a state where...
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| creator | TEJIMA TAKANORI |
| description | PROBLEM TO BE SOLVED: To simplify a configuration of a mold die used in resin molding, prevent damages of a heat generating element, and eliminate a configuration for insulating. SOLUTION: The semiconductor of the present invention is configured such that the resin mold is performed in a state where an insulating film 18 consisting of a compressible and deformable material is attached to each external surface of a pair of heat sinks 13 and 14, and can prevent the resin 19 from traveling to each of the external surface of the heat sinks 13 and 14. Because of this, the configuration of the mold die 20 is simplified. In addition, the damage of the heat generating element 12 is prevented since a pressure of the mold die 20 can be buffered by the insulating film 12. Further, the configuration for insulating can be eliminated since the insulating film 18 is attached to each external surface of the heat sinks 13 and 14. |
| format | Patent |
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SOLUTION: The semiconductor of the present invention is configured such that the resin mold is performed in a state where an insulating film 18 consisting of a compressible and deformable material is attached to each external surface of a pair of heat sinks 13 and 14, and can prevent the resin 19 from traveling to each of the external surface of the heat sinks 13 and 14. Because of this, the configuration of the mold die 20 is simplified. In addition, the damage of the heat generating element 12 is prevented since a pressure of the mold die 20 can be buffered by the insulating film 12. Further, the configuration for insulating can be eliminated since the insulating film 18 is attached to each external surface of the heat sinks 13 and 14.</description><edition>7</edition><language>eng</language><subject>AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING ; BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULARARTICLES ; PERFORMING OPERATIONS ; SEMICONDUCTOR DEVICES ; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR ; SHAPING OR JOINING OF PLASTICS ; TRANSPORTING ; WORKING OF PLASTICS ; WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL</subject><creationdate>2002</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20021108&DB=EPODOC&CC=JP&NR=2002324816A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20021108&DB=EPODOC&CC=JP&NR=2002324816A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>TEJIMA TAKANORI</creatorcontrib><title>SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME</title><description>PROBLEM TO BE SOLVED: To simplify a configuration of a mold die used in resin molding, prevent damages of a heat generating element, and eliminate a configuration for insulating. SOLUTION: The semiconductor of the present invention is configured such that the resin mold is performed in a state where an insulating film 18 consisting of a compressible and deformable material is attached to each external surface of a pair of heat sinks 13 and 14, and can prevent the resin 19 from traveling to each of the external surface of the heat sinks 13 and 14. Because of this, the configuration of the mold die 20 is simplified. In addition, the damage of the heat generating element 12 is prevented since a pressure of the mold die 20 can be buffered by the insulating film 12. 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SOLUTION: The semiconductor of the present invention is configured such that the resin mold is performed in a state where an insulating film 18 consisting of a compressible and deformable material is attached to each external surface of a pair of heat sinks 13 and 14, and can prevent the resin 19 from traveling to each of the external surface of the heat sinks 13 and 14. Because of this, the configuration of the mold die 20 is simplified. In addition, the damage of the heat generating element 12 is prevented since a pressure of the mold die 20 can be buffered by the insulating film 12. Further, the configuration for insulating can be eliminated since the insulating film 18 is attached to each external surface of the heat sinks 13 and 14.</abstract><edition>7</edition><oa>free_for_read</oa></addata></record> |
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| subjects | AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULARARTICLES PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL |
| title | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME |
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