METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To automate the detection of the projection caused by the deformation of a bump electrode. SOLUTION: In a semiconductor device manufacturing method which inspects a semiconductor device where a plurality of bump electrodes are made in planar forms on the mounting face of the se...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	AKAIWA MASAYASU
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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