INTEGRATED CIRCUIT DEVICE, MANUFACTURING METHOD THEREFOR AND IC CARD USING THE SAME
PROBLEM TO BE SOLVED: To provide a highly reliable integrated circuit device of high quality and an IC card using it. SOLUTION: The integrated circuit device 21 is constituted by providing a resin frame body 24 on a wiring board 28 provided with a conductor 22 to be a terminal for external connectio...
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| creator | KASHIMA MASANORI |
| description | PROBLEM TO BE SOLVED: To provide a highly reliable integrated circuit device of high quality and an IC card using it. SOLUTION: The integrated circuit device 21 is constituted by providing a resin frame body 24 on a wiring board 28 provided with a conductor 22 to be a terminal for external connection and covering an integrated circuit element 25 and a connection means 26 formed on the inner side of the resin frame body 24 with a sealing resin 27. |
| format | Patent |
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| language | eng |
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| subjects | BASIC ELECTRIC ELEMENTS BOOK COVERS BOOKBINDING CALCULATING COMPUTING COUNTING DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDEDFOR ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FILES HANDLING RECORD CARRIERS LOOSE LEAVES MOVABLE-STRIP WRITING OR READING APPARATUS PERFORMING OPERATIONS PHYSICS PRESENTATION OF DATA PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITYFEATURES PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOTOTHERWISE PROVIDED FOR RECOGNITION OF DATA RECORD CARRIERS SEMICONDUCTOR DEVICES SPECIAL PRINTED MATTER TRANSPORTING |
| title | INTEGRATED CIRCUIT DEVICE, MANUFACTURING METHOD THEREFOR AND IC CARD USING THE SAME |
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