MOUNTING METHOD AT WAFER LEVEL

PROBLEM TO BE SOLVED: To provide a mounting method at wafer level for a simplified process by appropriately forming a stress buffer layer on a wafer instead of an underfill. SOLUTION: A patterned photoresist is formed on a wafer 100 so as to cover a bump formation position and a plurality of scribe...

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1. Verfasser:	YIH MUH-MIN
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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