REPRODUCTION METHOD OF BUMP

PROBLEM TO BE SOLVED: To provide a reproduction method of a bump. SOLUTION: A defective bump is removed from a wafer through chemical etching. During etching, etchant damages a passivation layer on a wafer somewhat. Therefore, a global metal layer covering a bonding pad and a passivation layer is ne...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	YIH MUH-MIN, TSAI CHIN-YING
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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