COPPER ALLOY MATERIAL FOR ELECTRONIC-ELECTRICAL PARTS
PROBLEM TO BE SOLVED: To improve the whisker resistance of a copper alloy material for electrical-electronic parts without damaging the advantages of the excellent press blanking properties and low friction coefficient of bright electrotinning. SOLUTION: Bright electrotinning having a plating thickn...
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creator | OGURA TETSUZO |
description | PROBLEM TO BE SOLVED: To improve the whisker resistance of a copper alloy material for electrical-electronic parts without damaging the advantages of the excellent press blanking properties and low friction coefficient of bright electrotinning. SOLUTION: Bright electrotinning having a plating thickness of 0.5 to 2 μm, and in which the reflectivity of the surface is |
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SOLUTION: Bright electrotinning having a plating thickness of 0.5 to 2 μm, and in which the reflectivity of the surface is <=30%, the content of C in the plating is 0.05 to 1 mass%, and the crystal grain size of the plating is 0.1 to 1 μm, and the orientation index of the (101) plane in the plating is <=2.0 is applied to a copper alloy containing 0.1 to 10 mass% Zn.</description><edition>7</edition><language>eng</language><subject>ALLOYS ; APPARATUS THEREFOR ; BASIC ELECTRIC ELEMENTS ; CHEMISTRY ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; ELECTROFORMING ; ELECTROLYTIC OR ELECTROPHORETIC PROCESSES ; FERROUS OR NON-FERROUS ALLOYS ; METALLURGY ; PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS ; SEMICONDUCTOR DEVICES ; TREATMENT OF ALLOYS OR NON-FERROUS METALS</subject><creationdate>2002</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20020918&DB=EPODOC&CC=JP&NR=2002266095A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25563,76318</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20020918&DB=EPODOC&CC=JP&NR=2002266095A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>OGURA TETSUZO</creatorcontrib><title>COPPER ALLOY MATERIAL FOR ELECTRONIC-ELECTRICAL PARTS</title><description>PROBLEM TO BE SOLVED: To improve the whisker resistance of a copper alloy material for electrical-electronic parts without damaging the advantages of the excellent press blanking properties and low friction coefficient of bright electrotinning. SOLUTION: Bright electrotinning having a plating thickness of 0.5 to 2 μm, and in which the reflectivity of the surface is <=30%, the content of C in the plating is 0.05 to 1 mass%, and the crystal grain size of the plating is 0.1 to 1 μm, and the orientation index of the (101) plane in the plating is <=2.0 is applied to a copper alloy containing 0.1 to 10 mass% Zn.</description><subject>ALLOYS</subject><subject>APPARATUS THEREFOR</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CHEMISTRY</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>ELECTROFORMING</subject><subject>ELECTROLYTIC OR ELECTROPHORETIC PROCESSES</subject><subject>FERROUS OR NON-FERROUS ALLOYS</subject><subject>METALLURGY</subject><subject>PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>TREATMENT OF ALLOYS OR NON-FERROUS METALS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2002</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZDB19g8IcA1ScPTx8Y9U8HUMcQ3ydPRRcPMPUnD1cXUOCfL383TWhTA9nYEyAY5BIcE8DKxpiTnFqbxQmptByc01xNlDN7UgPz61uCAxOTUvtSTeK8DIwMDIyMzMwNLU0ZgoRQBBFSgn</recordid><startdate>20020918</startdate><enddate>20020918</enddate><creator>OGURA TETSUZO</creator><scope>EVB</scope></search><sort><creationdate>20020918</creationdate><title>COPPER ALLOY MATERIAL FOR ELECTRONIC-ELECTRICAL PARTS</title><author>OGURA TETSUZO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2002266095A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2002</creationdate><topic>ALLOYS</topic><topic>APPARATUS THEREFOR</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CHEMISTRY</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>ELECTROFORMING</topic><topic>ELECTROLYTIC OR ELECTROPHORETIC PROCESSES</topic><topic>FERROUS OR NON-FERROUS ALLOYS</topic><topic>METALLURGY</topic><topic>PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>TREATMENT OF ALLOYS OR NON-FERROUS METALS</topic><toplevel>online_resources</toplevel><creatorcontrib>OGURA TETSUZO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>OGURA TETSUZO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>COPPER ALLOY MATERIAL FOR ELECTRONIC-ELECTRICAL PARTS</title><date>2002-09-18</date><risdate>2002</risdate><abstract>PROBLEM TO BE SOLVED: To improve the whisker resistance of a copper alloy material for electrical-electronic parts without damaging the advantages of the excellent press blanking properties and low friction coefficient of bright electrotinning. SOLUTION: Bright electrotinning having a plating thickness of 0.5 to 2 μm, and in which the reflectivity of the surface is <=30%, the content of C in the plating is 0.05 to 1 mass%, and the crystal grain size of the plating is 0.1 to 1 μm, and the orientation index of the (101) plane in the plating is <=2.0 is applied to a copper alloy containing 0.1 to 10 mass% Zn.</abstract><edition>7</edition><oa>free_for_read</oa></addata></record> |
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subjects | ALLOYS APPARATUS THEREFOR BASIC ELECTRIC ELEMENTS CHEMISTRY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES FERROUS OR NON-FERROUS ALLOYS METALLURGY PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS SEMICONDUCTOR DEVICES TREATMENT OF ALLOYS OR NON-FERROUS METALS |
title | COPPER ALLOY MATERIAL FOR ELECTRONIC-ELECTRICAL PARTS |
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